H05K1/032

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE

A resin composition that has both excellent flux activity and high insulation reliability, that possesses good storage stability, and that further has flexibility with good operability upon being used as a laminate is provided. The resin composition contains a chelating flux agent (A), a thermal radical polymerization initiator (B) and a radical polymerizable compound (C).

FLEXIBLE BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
20210100094 · 2021-04-01 ·

A flexible board includes a flexible resin base material, a conductor pattern on a principal surface of the resin base material and including first and second electrodes electrically separated from each other, a first protective film having lower flexibility than the resin base material and covering a portion of the conductor pattern, and a second protective film having higher flexibility than the first protective film and extending over the principal surface of the resin base material and the first protective film to cover another portion of the conductor pattern. The first protective film is closer to the first and second electrodes on the principal surface of the resin base material than the second protective film. The first protective film includes a first opening exposing a portion of the first electrode and a second opening exposing a portion of the second electrode in planar view.

Resin composition and uses of the same

A resin composition comprising the following constituents: (A) a polyphenylene ether resin with unsaturated end groups; (B) a constituent with a maleimide structure; (C) a first initiator, which has a first one-minute half-life temperature; and (D) a second initiator, which has a second one-minute half-life temperature, wherein the first one-minute half-life temperature is 20° C. to 50° C. higher than the second one-minute half-life temperature, and the first one-minute half-life temperature is 170° C. to 220° C.

PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSING SYSTEM
20210086721 · 2021-03-25 ·

A pressure sensing system (24), seat cushion (20) incorporating the pressure sensing system, and method of sensing a weight group associated with an occupant of an automotive seat are described. The pressure sensing system includes a layer of an electrically conductive foam (28) and a flexible printed circuit (26) that includes a flexible substrate (26a) and N horizontal sensing wires (26b) and M vertical sensing wires (26c) securely placed on a top surface of the flexible substrate. The horizontal sensing wires intersect with the vertical sensing wires and form NM intersections. The layer of an electrically conductive foam is placed on top of the N horizontal sensing wires and the M vertical sensing wires. When a pressure is applied to the layer of the electrically conductive foam, each intersection generates in real time an electric flux density value to reflect a degree of a compression caused by the pressure to a corresponding point of the electrically conductive foam.

STRAIN GAUGE AND SENSOR MODULE

The present strain gauge includes a substrate having flexibility; a resistor formed from a material containing at least one of chromium and nickel, on the substrate; a pair of wiring patterns formed on the substrate and electrically connected to both ends of the resistor; and a pair of electrodes formed on the substrate and electrically connected to the pair of wiring patterns, respectively. The wiring patterns include a first layer extending from the resistor, and a second layer having a lower resistance than the first layer and layered on the first layer. On the substrate, an electronic component mounting area is demarcated, on which an electronic component electrically connected to the electrodes is mounted.

FLEXIBLE SUBSTRATE AND A METHOD THEREOF
20210068245 · 2021-03-04 ·

A flexible substrate and a method thereof are provided. The flexible substrate includes a first flexible layer fabricated with at least one conducting path, and configured to sustain an electric power within the conducting path, a second flexible layer fabricated with one or more sensors connected in a form of a matrix, and The second flexible layer configured to generate a signal upon receiving an interaction from at least one user, a third flexible layer fabricated in-between the first flexible layer and the second flexible layer, and configured to insulate the conducting path of the first flexible layer from a matrix connection of the second flexible layer, at least one support structure operatively coupled to the first flexible layer, the second flexible layer and the third flexible layer, and configured to receive the signal generated by the second flexible layer and to provide a support.

Stretchable sensor and method of manufacturing the same and wearable device

A stretchable sensor includes a stretchable layer including an elastomer, and a conductive layer at least partially buried in the stretchable layer and including a conductive nanostructure. The stretchable layer includes a plurality of first regions including a ferromagnetic material buried in the elastomer, and a second region excluding the plurality of first regions.

ELECTRONIC CIRCUIT
20210037658 · 2021-02-04 ·

An electronic circuit (4) comprises at least one electrically conductive portion arranged to a substrate (2) and at least one electrical coupling point (5) determined at the at least one electrically conductive portion. The electronic circuit (4) comprises at the at least one electrical coupling point (5) at least one magnetic and electrically conductive coupling element (6a, 6b, 6c, 6d, 6e, 6f, 6g, 6h, 6i, 6j, 6k, 6l) for providing an electrically conductive coupling point (5) with magnetic fastening force.

Printed circuit board

Generally, the present disclosure provides example embodiments relating to a printed circuit board (PCB). In an embodiment, a structure includes a PCB including insulating layers with respective metal layers being disposed therebetween. Each of first layers of the insulating layers includes a first fiberglass content. A second layer of the insulating layers has a second fiberglass content less than the first fiberglass content. For example, in some embodiments, the second insulating layer does not include a fiberglass matrix.

Flexible substrate and a method thereof

A flexible substrate and a method thereof are provided. The flexible substrate includes a first flexible layer fabricated with at least one conducting path, and configured to sustain an electric power within the conducting path, a second flexible layer fabricated with one or more sensors connected in a form of a matrix, and the second flexible layer configured to generate a signal upon receiving an interaction from at least one user, a third flexible layer fabricated in-between the first flexible layer and the second flexible layer, and configured to insulate the conducting path of the first flexible layer from a matrix connection of the second flexible layer, at least one support structure operatively coupled to the first flexible layer, the second flexible layer and the third flexible layer, and configured to receive the signal generated by the second flexible layer and to provide a support.