Provided is a method for manufacturing an LCP film for a circuit substrate capable of achieving an LCP film for a circuit substrate having a low coefficient of linear thermal expansion and excellent dimensional stability, without excessively impairing excellent basic performance possessed by the liquid crystal polyester, such as mechanical characteristics, electrical characteristics, and heat resistance. The method for manufacturing an LCP film for a circuit substrate at least comprising: a composition provision step of providing an LCP resin composition at least containing 100 parts by mass of a liquid crystal polyester and 1 to 20 parts by mass of a polyarylate; a film forming step of T-die melt-extruding the LCP resin composition to form a T-die melt-extruded LCP film having a coefficient of linear thermal expansion (α2) in a TD direction of 50 ppm/K or more; and a pressurizing and heating step of subjecting the T-die melt-extruded LCP film to pressure and heat treatment to obtain an LCP film for a circuit substrate having a coefficient of linear thermal expansion (α2) in the TD direction of 16.8±12 ppm/K.

To provide a molded product, a metal-clad laminate and a printed wiring board, each of which contains a tetrafluoroethylene type polymer, whereby an decrease in electrical characteristics is inhibited and a hole can be easily bored with UV-YAG laser; and methods for their production. A molded product containing a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength range where the extinction coefficient becomes to be from 1.2 to 4.5 at from 200 to 380 nm; and a method for its production. A metal-clad laminate having a conductive metal layer and a layer of the molded product; and a method for its production. A printed wiring board provided with the metal-clad laminate and having through-holes in the thickness direction of the polymer layer.

A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.

To provide a dielectric composition having excellent reliability. The dielectric composition contains a main component represented by a composition formula (Sr.sub.1-xCa.sub.x).sub.m(Ti.sub.1-yHf.sub.y)O.sub.3-δN.sub.δ, in which 0.15<x≤0.90, 0<y≤0.15, 0.90≤m≤1.15, 0<δ≤0.05 are satisfied.

A laminate that includes a substrate made of a polyolefin-based resin and is excellent in adhesion between the substrate and a metal plating layer is provided in a simple manner without roughening the surface of the substrate. In addition, a molded article, a printed wring board, and an electromagnetic wave shield using the laminate using the same are provided. Used is a laminate configured such that on a substrate (A) made of a polyolefin-based resin (a), a primer layer (B) containing a polyolefin-based resin (b) that is organic solvent soluble or water dispersible, a metal particle layer (C), and a metal plating layer (D) are sequentially laminated.

A method and apparatus of electrode interfaces for stimulating neurons and nerve cells that provides micro-fabricated electrode interfaces configured for conformal placement adjacent to neuron, nerves and neural tissue to thereby allow the neuron, nerves and neural tissue to grow around the electrode interfaces and allow for the creation depending on configuration of local or far electrical fields and current flows to stimulate them.

[Problem] Provided is a resin composition, resin sheet, prepreg and printed wiring board capable of obtaining excellent low permittivity, low dielectric loss tangent, flexibility and peel strength.

[Solution Means] A resin composition containing (A) a maleimide compound exhibiting a relative permittivity of lower than 2.7, (B) a polyphenylene ether compound represented by general formula (1) below and having a number-average molecular weight of 1000 to 7000, and (C) a block copolymer with a styrene skeleton. In general formula (1), X represents an aryl group, —(Y—O)n.sub.2- represents a polyphenylene ether portion, R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom or an alkyl, alkenyl or alkynyl group, n.sub.2 represents an integer of 1 to 100, n.sub.1 represents an integer of 1 to 6 and n.sub.3 represents an integer of 1 to 4.

##STR00001##

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, R.sup.2 represents a hydrogen atom, or formula (1a) or formula (1b), and at least one R.sup.2 is formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.

##STR00001##

A ceramic and polymer composite including: a first continuous phase comprising a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity or a porous void space of from 50 to 15 vol %, based on the total volume of the composite; and a second continuous polymer phase situated in the porous void space of the sintered porous ceramic. Also disclosed is a composite article, a method of making the composite, and a method of using the composite.

An interconnect substrate includes a first insulating layer, an interconnect layer formed on a first surface of the first insulating layer, and a second insulating layer formed on the first surface of the first insulating layer to cover the interconnect layer, wherein the second insulating layer includes a first resin layer and a second resin layer, the first resin layer covering at least part of a surface of the interconnect layer exposed outside the first insulating layer, the second resin layer covering the first resin layer, wherein both the first resin layer and the second resin layer contain a resin and a filler, and wherein a proportion of the resin in the first resin layer per unit area is higher than a proportion of the resin in the second resin layer per unit area.