According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.

A method can be used for manufacturing a metal substrate structure for a semiconductor power module. A plurality of terminals are welded to a metal top layer. After the welding, a dielectric layer is coupled between the metal top layer and a metal bottom layer. The dielectric can be laminated or molded, as examples.

A metal substrate includes a first insulating substrate, a second insulating substrate, a first metal layer, a second metal layer and a release layer. The first insulating substrate has a first modified surface and a second surface opposite to the first modified surface. The first metal layer faces the second surface. The release layer is bonded on the first modified surface. The second insulating substrate is bonded on a side of the release layer, such that the release layer is between the first modified surface and the second insulating substrate. The second metal layer is disposed on a side of the second insulating substrate, such that the second insulating substrate is between the release layer and the second metal layer. An original surface roughness of the first modified surface has a variation substantially less than 10% after the first modified surface is released from the release layer.

An LED lamp having a metal PCB bent polyhedrally and a method for manufacturing the LED lamp is provided, where a base constituting the metal PCB has a rectangular or geometric shape and is configured to have a plurality of base stepped grooves formed spaced apart from each other on the underside thereof in such a manner as to be bent upward or downward from the base to form reflection surfaces continuously, so that at the time when both ends of the base come into contact with the plane, the base has a geometric shape in which the base is located in space through the reflection surfaces continuously arranged.

This heat sink integrated insulating circuit substrate includes: a heat sink including a top plate part and a cooling fin; an insulating resin layer formed on the top plate part of the heat sink; and a circuit layer made of metal pieces arranged on a surface of the insulating resin layer opposite to the heat sink, wherein, when a maximum length of the top plate part is defined as L, an amount of warpage of the top plate part is defined as Z, and deformation of protruding toward a bonding surface side of the top plate part of the heat sink is defined as a positive amount of warpage, and a curvature of the heat sink is defined as C=|(8×Z)/L.sup.2|, a ratio P/C.sub.max between a maximum curvature C.sub.max(l/m) of the heat sink during heating from 25° C. to 300° C. and peel strength P (N/cm) of the insulating resin layer satisfies P/C.sub.max>60.

An insulated circuit substrate manufacturing method of the present invention includes a metal piece disposing step of disposing the metal piece in a circuit pattern shape on a resin material serving as the insulating resin layer and a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating direction. In the bonding step, the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig that includes a cushion material disposed on a side of the metal piece and a guide wall portion disposed at a position facing a peripheral portion of the cushion material, and the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization.

A circuit board according to an embodiments includes an insulating portion comprising a plurality of insulating layers, wherein the insulating portion includes: a first insulating portion; a second insulating portion disposed on the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; and a third insulating portion disposed under the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; wherein the first insulating portion includes a prepreg including glass fibers, and wherein the second and third insulating portions include a resin coated copper (RCC) with a coefficient of thermal expansion in the range of 10 to 65 (10.sup.−6 m/m.Math.k).

An opto-electric hybrid board includes an optical waveguide, and an electric circuit board disposed on a one-side surface in the thickness direction of the optical waveguide. The electric circuit board includes a first terminal on which an optical element portion is mounted and a second terminal on which a driver element portion is mounted. The electric circuit board includes a metal supporting layer that overlaps the first terminal and the second terminal when the electric circuit board is projected in the thickness direction. The metal supporting layer has an opening portion that is located between the first terminal and the second terminal when the metal supporting layer is projected in the thickness direction.

The present invention provides a heat dissipation conductive flexible board, which is assembled from: at least a single layer thin board, the structure of which includes a first conductive thin layer and a first functional thin layer, and at least a double layer thin board, the structure of which includes a second conductive thin layer, a second functional thin layer, and a third functional thin layer. A spraying, coating, or printing method is used to manufacture the single layer thin board and the double layer thin board; after which the single layer thin board and the double layer thin board are laminated together to form the heat dissipation conductive flexible board having a multi-layer conductive structure.