An object is to solve problems associated with a stretchable wire member that includes, for example, a garment with stretchable wires formed thereon, that is, to solve the problems of wrinkles and undulations that often occur after the garment is stretched. A stretchable wire member includes a fabric; a base layer disposed on a surface of the fabric; a conductive layer disposed in part of the fabric, the conductive layer being on a surface of the base layer; and a protective layer covering the conductive layer. In the stretchable wire member, an elastic modulus E′3 of a multilayer body portion including the fabric, the base layer, and the protective layer ranges from 1 MPa to 6 MPa.

To provide a metal particle composition having excellent oxidation resistance, which does not require a transition metal catalyst and can be applied to existing metal particles, a method for producing the metal particle composition, and a paste. The metal particle composition contains, with respect to 100 parts by mass of metal particles, 0.1 to 5 parts by mass of a compound (A) having a structure represented by the following general formula (I):

##STR00001## in which R.sup.1 and R.sup.2 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, or an aralkyl group, R.sup.3 and R.sup.4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group, an alkenyl group having 2 to 6 carbon atoms, an alkenyloxy group, an aryl group, or an aralkyl group.

A conductive textile includes a base cloth and a conductive film disposed on the base cloth. The conductive film includes a polyurethane resin and a silver bearing conductor, in which a content of the silver bearing conductor is 55 parts by weight to 80 parts by weight, and a content of the polyurethane resin is 8 parts by weight to 12 parts by weight.

This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

A stretchable conductive substrate includes a substrate and a circuit layer. The substrate has a plurality of predetermined areas. The circuit layer is formed on the substrate and defines a conductive contact group and at least one elastic wire structure connected to the conductive contact group in each of the predetermined areas. The at least one elastic wire structure has at least one patterned wire segment and a stretch rate thereof along a length direction of the substrate is from 0% to 60%.

A via frame. In some embodiments, the via frame includes: a sheet of epoxy mold compound, having a plurality of holes each extending through the sheet of epoxy mold compound, and a plurality of conductive elements, each extending through a respective one of the holes.

A method for manufacturing a circuit board, includes obtaining a second laminated body by laminating, in this order, an uncured second insulating substrate and a resin film on a second surface opposite to a first surface of a cured first insulating substrate of a first laminated body, and performing thermocompression bonding thereon. The first laminated body includes the first insulating substrate and a metal layer that is formed into a pattern shape on the first surface of the first insulating substrate. A third laminated body is obtained by forming a hole that reaches the metal layer, in the resin film, the second insulating substrate, and the first insulating substrate, from a resin film side of the second laminated body, filling conductive paste into the hole, and then peeling off the resin film. Thermocompression bonding is performed by stacking one third laminated body and another third laminated body.

A method for forming a conductive fine pattern according to an embodiment forms a conductive fine pattern on a substrate having identical surface energy by using inkjet printing for printing ink along a path. The method includes a droplet ejection process of simultaneously performing, discharging photocurable ink at the front side of the path, discharging volatile ink containing minute metal particles at the rear side of the path, and applying light energy to the discharged photocurable ink. The light energy is configured to have a light intensity such that: the photocurable ink is semi-cured and ejected in a gel state on the substrate, and thus forms a boundary with liquid volatile ink ejected on the substrate; and the photocurable ink is completely cured after the ejection of both the photocurable ink and the volatile ink is completed.

A stretchable mounting board that includes a stretchable substrate having a main surface, a stretchable wiring disposed on the main surface of the stretchable substrate, a mounting electrode section electrically connected to the stretchable wiring, solder electrically connected to the mounting electrode section and including bismuth and tin, and an electronic component electrically connected to the mounting electrode section with the solder interposed therebetween. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.