Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a first main surface toward a second main surface to a position being away from the first main surface by a distance equivalent to 50% of a thickness of the conductive ink film has a first void ratio of 15% to 50%, a region that extends from a position being away from the second main surface toward the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film to the second main surface has a second void ratio which is smaller than the first void ratio, and the conductive ink film comprises at least one metal selected from the group consisting of silver, gold, platinum, nickel, palladium, and copper.

The disclosure relates to methods for fabricating coreless printed circuit board (PCB) based transformers and/or coreless PCB-based circuits containing one or more coil inductor(s). More specifically, the disclosure relates to methods for fabricating coreless PCB-based transformers and/or inductors having concatenated helix architecture of their primary and secondary windings using layer-by-layer printing of dielectric and conductive patterns.

A flake-less molecular ink suitable for printing (e.g. screen printing) conductive traces on a substrate has 30-60 wt % of a C.sub.8-C.sub.12 silver carboxylate and 0.1-10 wt % of a polymeric binder, or 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate and 0.25-10 wt % of a polymeric binder, and balance of at least one organic solvent, wherein the binder has ethyl cellulose, and the ethyl cellulose has an average weight molecular weight in a range of 60,000-95,000 g/mol and a bimodal molecular weight distribution.

The invention relates to a method to form copper nanoparticles. The method comprises heating a solution comprising a copper precursor comprising at least one neat copper carboxylate in a concentration of at least 0.2 M, a stabilizer comprising an amine in a concentration equal or larger than the concentration of the copper precursor and optionally a solvent to a temperature T1 to form metallic copper. The solution is then heated to a temperature T2, with the temperature T2 being at least 10° C. higher than the temperature T1. The solution is heated from temperature T1 to temperature T2 with an average rate of at least 2 degrees per minute.

The invention further relates to copper nanoparticles obtainable by such method and to formulations comprising such nanoparticles.

Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

The elastomeric electrode includes: a stretchable substrate 10 having wrinkles formed on one surface thereof, the peaks C and valleys T of the wrinkles being repeated; a wrinkled metal nanoparticle layer 20 including metal nanoparticles 21 and formed by deposition of the metal nanoparticles along the wrinkles of the substrate 10; and a wrinkled monomolecular layer 30 including a monomolecular material having one or more amine groups (—NH.sub.2) and formed by deposition of the monomolecular material onto the metal nanoparticle layer 20. Also disclosed is a method for preparing the elastomeric electrode.

A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

Composite electrodes and their methods of manufacture are disclosed. In one embodiment, an electrode may include a first layer including first particles, a second layer including conductive nanowires, and a third layer comprising second particles. The second layer may be disposed between and in electrical contact with the first layer and the third layer. The composite electrode may be substantially transparent in some embodiments.

The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

To provide novel low-temperature sinterable copper particles that can be sintered even at a low temperature of, for example, around 100° C. or less, and a method for producing a sintered body by using the same. The low-temperature sinterable copper particles according to the present invention are coated with a carboxylic acid, and a surface of the copper particle is oxidized so as to have a cuprous oxide fraction (Cu.sub.2O/(Cu+Cu.sub.2O)) in the copper particle of 4% by mass or less or so as to have an average coating thickness of cuprous oxide of 10 nm or less. The low-temperature sinterable copper particles are subjected to low-temperature firing in an atmosphere of 0.01 Pa or less.