A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

A device including an electrically conducting track arranged on a support includes a step of supply of the support, and a step of formation of the electrically conducting track on the support including a step of supply of a solution intended to be deposited on the support, a step of deposition of the solution by printing on the support. The step of supply of the solution is such that the solution supplied includes a mixture of a solvent, of a set of metal particles and of a metallic material having a melting point below that of the metal particles of the set of metal particles, and the method includes a step of melting of the metallic material which results in the formation of a solder of metallic material between metal particles of the set of metal particles.

A metallic nanoparticle dispersion includes metallic nanoparticles and a compound according to Formula I, ##STR00001##
wherein X represents the necessary atoms to form a substituted or unsubstituted ring. The presence of small amounts of the compound according to Formula I increases the conductivity of metallic layers or patterns formed from the metallic nanoparticle dispersions at moderate curing conditions.

A flowable, (e.g., screen printable, stencil printable and/or dispensable) thermally conductive paste is disclosed and provide low temperature curing or firing. The pastes are useful in forming thermally conductive pathways for electronic type applications, such as, providing thermal conduction between a semiconductor chip and its associate semiconductor chip packaging (e.g. power electronic applications), which can be useful in power converters, electrical power steering modules, car head lights (LEDs), solar cells, printed circuit boards (PCBs), plasma display panels (PDPs), and the like. The pastes have a combination of conductive flakes and particles in a minimal amount of carrier fluid and carrier resin to provide advantageous deposition and heat melding properties.

A metallic nanoparticle dispersion includes metallic nanoparticles, a liquid carrier, and a dispersion-stabilizing compound according to Formulae I, II, III or IV,

##STR00001##

wherein Q represents the necessary atoms to form a substituted or unsubstituted a five or six membered heteroaromatic ring; M is selected from the group consisting of a proton, a monovalent cationic group and an acyl group; R1 and R2 are independently selected from the group consisting of a hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted alkaryl group, a substituted or unsubstituted aralkyl group, a substituted or unsubstituted aryl or heteroaryl group, a hydroxyl group, a thioether, an ether, an ester, an amide, an amine, a halogen, a ketone and an aldehyde, R1 and R2 may represent the necessary atoms to form a five to seven membered ring; R3 to R5 are independently selected from the group consisting of a hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted alkaryl group, a substituted or unsubstituted aralkyl group, a substituted or unsubstituted aryl or heteroaryl group, a hydroxyl group, a thiol, a thioether, a sulfone, a sulfoxide, an ether, an ester, an amide, an amine, a halogen, a ketone, an aldehyde, a nitrile and a nitro group; and R4 and R5 may represent the necessary atoms to form a five to seven membered ring.

A metallic nanoparticle composition includes metallic nanoparticles and a non-aqueous polar protic solvent. The non-aqueous polar protic solvent has two hydroxyl groups, a boiling point of at least 280° C. at 760 mm Hg, and a viscosity in a range of 45 cP to 65 cP at 20° C. Polyvinylpyrrolidone (PVP) is present on the metallic nanoparticle surfaces. A concentration of metals in the metallic nanoparticle composition is in a range of 60 wt% to 90 wt% and a concentration, in aggregate, of solvents having a boiling point of less than 280° C. at 760 mm Hg in the metallic nanoparticle composition does not exceed 3 wt%.

The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.

Provided is a composition including a plurality of multi-metallic nanoparticles each consisting essentially of a core including at least one first metal (Me1) and a continuous shell including atoms of at least one second metal (Me2). Optionally, the continuous shell of Me2 atoms protects the Me1 atoms from oxidation at all temperatures less than 150° C.

A problem is to provide a silver paste which can produce, without variation in resistivity value, a conductive silver coating film exhibiting resistivity substantially equivalent to the resistance value of bulk silver in low-temperature sintering. The problem is solved by providing a silver paste including a silver nanoparticle aqueous dispersion prepared by using a compound having a polyethyleneimine skeleton as a protective agent, a compound having a functional group reactable with nitrogen atoms in the polyethyleneimine, and at least one compound selected from the group consisting of a compound having an amine functional group and a compound having an amide functional group.

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a metal layer formed on at least one surface side of the base film. In the substrate for a printed circuit board, a plurality of fine particles are disposed between the base film and the metal layer, and the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal. The fine particles preferably have an average particle size of 0.1 nm or more and 20 nm or less. The fine particles are preferably formed of a metal oxide or a metal hydroxide. The fine particles are preferably present between the base film and the metal layer so as to form a layer. The metal layer preferably includes a metal grain layer formed by firing metal nanoparticles.