A wiring board including: a frame base material; and a metal member, wherein the frame base material is formed in plate-shaped, and includes a through hole in a central region of the frame base material, the metal member includes a stage part and at least one bridge part, a width of the bridge part is equal to or narrower than a width of the stage part, the bridge part extending toward an outer side from the stage part, the stage part is arranged to be fit to the through hole, and the bridge part is arranged to be disposed facing the frame base material.

A wiring substrate includes an insulating layer, a stack including wiring layers and photosensitive-resin insulating layers on a first surface of the insulating layer, a wiring layer on a second surface of the insulating layer, having a lower wiring density than the wiring layers, a metal core plate buried in the insulating layer and positioned on the stack side with respect to the center of the insulating layer in its thickness direction, and a via wiring buried in the insulating layer to have a first end face exposed at the first surface and joined to the lowermost one of the wiring layers, and a second end face joined to the metal core plate. The first surface and the first end face are substantially flush with each other. The wiring layers include a signal line, and a ground line concentrically formed around the signal line, with a predetermined interval therebetween.

An example balun includes a center conductor that passes through a printed wiring board having multiple dielectric layers and cage vias arranged relative to the center conductor. The cage vias include a first set of cage vias that extend between an unbalanced connection to the balun and a balanced connection to the balun. The first set of cage vias are part of a first circular arc and are connected to electrical ground through a first ground ring. The cage vias include a second set of cage vias that extend from the unbalanced connection part-way through the printed wiring board. The second set of cage vias are part of a second circular arc and are connected to the electrical ground through a second ground ring. The second circular arc is longer than the first circular arc.

A connector includes a metal cylinder with three or more slots cut from a first end and three or more slots cut from a second end which are intercalated between the slots from the first end, whereby the connector is radially compressible along its entire length. The connector is adapted for insertion at one end into a hole in a circuit board, thereby making electrical contact to traces in the circuit board.

A package substrate includes a dielectric layer, a conductive via disposed in the dielectric layer, and a conductive pattern layer exposed from a first surface of the dielectric layer. The conductive pattern layer includes traces and a via land, the via land extends into the conductive via, and a circumferential portion of the via land is encompassed by the conductive via. A method of making a package substrate includes forming a conductive pattern layer including traces and a via land, providing a dielectric layer to cover the conductive pattern layer, and forming a via hole. Forming the via hole is performed by removing a portion of the dielectric layer and exposing a bottom surface of the via land and at least a portion of a side surface of the via land. A conductive material is applied into the via hole to form a conductive via covering the via land.

A wiring board includes an insulating base including a first principal surface, a second principal surface opposite to the first principal surface, and a first through hole penetrating the insulating base from the first principal surface to the second principal surface, a functional material provided inside the first through hole, a first insulating layer covering the first principal surface, and a first surface of the functional material, and a second insulating layer covering the second principal surface, and a second surface of functional material. A second through hole is formed in the first insulating layer, the functional material, and the second insulating layer, and a conductive layer is formed on a wall surface of the second through hole.

A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure and at least one conductive through via. The conductive structure includes a plurality of dielectric layers, a plurality of circuit layers in contact with the dielectric layers, and a plurality of dam portions in contact with the dielectric layers. The dam portions are substantially arranged in a row and spaced apart from one another. The conductive through via extends through the dam portions.

A system for electrically coupling a garment to a mating object and manufacture method thereof, the system comprising: a fabric interlayer of the garment including a set of ports; an electronics substrate having a first surface adjacent to a second side of the fabric interlayer and including a set of vias through a thickness of the electronics substrate, aligned with the set of ports, and a set of contacts at a second surface opposing the first surface; a mount assembly having a third surface adjacent to the second surface of the electronics substrate and including a set of holes aligned with the set of vias and the set of ports, as well as a set of openings that correspond to and receive portions of the set of contacts, and a fourth surface opposing the third surface and defining a cavity configured to receive and electrically interface the mating object to the electronics substrate; and a set of fasteners that 1) compress the backing plate, the fabric interlayer, the electronics substrate, and the mount assembly by way of the set of ports, the set of vias, and the set of holes in supporting a waterproof seal, and 2) electrically couple the set of embedded ports to the set of vias.

A circuit board including a through-hole into which a press-fit terminal portion is inserted in a depth direction; an inner wall land provided on an inner wall of the through-hole; and a plurality of inner layer lands which are provided in an inner layer of the circuit board, are planes substantially parallel to a mounting surface of the circuit board, and are in contact with the inner wall land. The inner wall land has a first region that is in contact with the press-fit terminal portion and a second region that is not in contact with the press-fit terminal portion. Among the plurality of inner layer lands, a first inner layer land, which is an inner layer land disposed on an identical surface with the first region of the inner wall land, is wider than a second inner layer land which is an inner layer land disposed on an identical surface with the second region of the inner wall land.

A communication plug configured to be mated with a communication outlet. The plug has first contacts configured to physically contact and form electrical connections with second contacts of the outlet. The plug also includes a substrate with wire contacts and first, second, third, and fourth layers. The first layer includes first conductors connecting a first portion of the first contacts with a first portion of the wire contacts. The fourth layer includes second conductors connecting a second portion of the first contacts with a second portion of the wire contacts. The second layer includes a first plurality of capacitor plates electrically connected to first selected ones of the first contacts. The third layer includes a second plurality of capacitor plates electrically connected to second selected ones of the first contacts. Each of the first plurality of capacitor plates forms a capacitor with at least one of the second plurality of capacitor plates.