A printed circuit board includes an insulating layer and a circuit layer disposed on the insulating layer. The circuit layer includes a first circuit pattern and a second circuit pattern. Each of the first and second circuit patterns has a first side surface, a second side surface opposing the first side surface, and a top surface connected to ends of the first and second side surfaces, when viewed in a cross section direction. The first side surface of the first circuit pattern and the first side surface of the second circuit pattern face each other. A height of the first side surface of the first circuit pattern is greater than a height of the second side surface of the first circuit pattern, and a height of the first side surface of the second circuit pattern is greater than a height of the second side surface of the second circuit pattern.

An inverter with a modular bus assembly is described. In various embodiments, the modular bus assembly includes a laminated motherboard and a plurality of capacitor daughtercards. The laminated motherboard can be configured to interface a plurality of phase-leg modules and a plurality of capacitor daughtercards through a plurality of terminals and connectors located on a bottom side or a top side of the laminated motherboard. The laminated motherboard includes a layer stack with a plurality of conductor layers. Each of the plurality of conductor layers is implemented with a net spacing from a neighboring plated through hole (PTH) based at least in part on differences in potential to be applied to each of the plurality of conductor layers as compared to a potential to be applied to the PTH. Embedded shield polygons can be implemented on the laminated motherboard to mitigate surface discharge at surface terminal (PTH/SMT) triple junctions.

A surgical stapling device includes a handle assembly, an adapter assembly, and a reload assembly that is releasably secured to the adapter assembly to facilitate replacement of the reload assembly after each use of the stapling device. The reload assembly includes an authentication chip and printed circuit board assembly that is constructed to provide electrical contacts that are self-supporting to allow for automated assembly of the electrical contacts and provide a more reliable, robust electrical connection between the electrical contacts and the chip.

An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.

The disclosure relates to a machining station for machining platelike workpieces (1) by means of at least one tool (10, 13, 14). The machining station has a measuring device (16) for acquiring data relating to the position of bores, a drill (10, 13, 14) for generating bores in the workpiece (1), and a data processor (17) for processing data of the at least one measuring device (16) and/or for controlling the at least one drill (10, 13, 14). The data processor (17) is here suitable and set up for performing an adjustment between a desired drilling position and/or a desired bore depth and an actual position and/or actual depth as determined by the at least one measuring device (16) for a bore present in the workpiece (1), and adapting the drilling position and/or bore depth for generating bores by means of the at least one drill (10, 13, 14).

An electronic device includes first and second circuit boards and an interposer substrate. The first principal surface of the interposer substrate faces the first circuit board, and the second principal surface of the interposer substrate faces the second circuit board. A first input/output pad and a first auxiliary pad are provided on the first principal surface of the interposer substrate, and a second input/output pad and a second auxiliary pad portion are provided on the second principal surface of the interposer substrate. The first circuit board includes a land that is connected to the first input/output pad and the first auxiliary pad, and the second circuit board includes a land that is connected to the second input/output pad and the second auxiliary pad portion.

The disclosure provides a circuit board that includes: a carrier element having a number of circuit board layers; a number of electronic components; a number of thermal interfaces; and a number of electrical interfaces. The electronic components are arranged directly on at least one of the surface sides on the carrier element. The opposite surface side of the carrier element is of potential-free design. Additionally, the circuit board with the electronic components is overlaid by a covering material in such a way that the electronic components are mechanically stabilized and the thermal and/or electrical interfaces are free of the covering material.

A printed circuit board includes a circuit board body and a solder pad row disposed on a back of the circuit board body. The solder pad row includes a solder thief pad and a plurality of circular pin solder pads. An outline of an edge, on the solder thief pad proximate to the pin solder pads is an arc that is concave toward the solder thief pad.

The disclosure relates to a printed circuit board having at least two current-conducting layer plies, wherein the current-conducting layer plies extend in an axial direction of the printed circuit board and are arranged in succession in a thickness direction of the printed circuit board. A component fastened by THT is arranged on one side of the printed circuit board. At least one connecting element extends through the printed circuit board through a passage opening in the thickness direction. The current-conducting layer ply is adjacent to the component fastened by THT reaches as far as the connecting element and the current-conducting layer ply that is remote from the component fastened by THT is at a distance from the connecting element.