A circuit board may include a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together and a via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board, the via comprising a first via portion comprising electrically-conductive material and having a first diameter and a first depth from a surface of the circuit board and a second via portion comprising electrically-conductive material and having a second diameter smaller than the first diameter and a second depth from the first depth.

An antenna (100) comprises a waveguide (120) formed by a first horizontal conductive layer (121) of a multi-layer circuit board (110), a second horizontal conductive layer (122) of the multi-layer circuit board, and vertical sidewalls formed by conductive vias (123, 124) extending between the first conductive layer (121) and the second conductive layer (122). Further, the antenna (100) of comprises a parallel plate resonator (150) at one end of the waveguide (120). The parallel plate resonator (150) is formed in the multilayer circuit board (110), by a first horizontal conductive plate (151) adjacent to the first conductive layer (121) and a second horizontal conductive plate (152) adjacent to the second conductive layer (122). Further, the antenna (100) comprises at least one conductive via (155) extending from one of the first conductive plate (151) and the second conductive plate (152) towards the other of the first conductive plate (151) and the second conductive plate (151).

A printed circuit board module (10) has a printed circuit board (20) with a first side (21), a second side (22) and a contact hole (30). A sleeve-type via (32) is provided in the contact hole 30. An annular ring (35, 36) is associated with the via (32), on at least one side (33, 34). The annular ring (35, 36) is arranged on the first side (21) or on the second side (22) of the printed circuit board (20). The annular ring (35, 36) is electrically connected to the via (32). The annular ring (35, 36) has an annular ring edge (40), at least in sections. The printed circuit board module (10) has a solder resist layer (50). It extends, at least in sections, from outside the annular ring edge (40) over the annular ring edge (40) to an outer region (42) of the annular ring (35, 36). An inner region (44) not covered with the solder resist layer (50), remains on the annular ring (35, 36).

A circuit board is disclosed, including a circuit board body and at least one via apparatus provided on the circuit board body. The via apparatus includes a via (101) formed on the circuit board body, a via pad (201) surrounding the via and separately provided from the via, and an electrical conductor (301) electrically connecting the via pad (201) with the via (101).

A multi-layer PCB has conductive vias (134) passing through multiple layers. A layer may have a conductive non-functional feature (710) physically contacting a via but not surrounding the via, to make the PCB more resistant to thermal stresses while, at the same time, reducing the parasitic capacitance compared to a prior art non-functional pad (310n).

A high-frequency module includes a circuit board including wiring patterns, a resin on an active element mounted on the circuit board and a side of the circuit board and sealing the active element, and connection conductors penetrating the resin from a surface of the resin and provided on a top surface of the active element. The active element includes a first connection electrode on a surface facing the circuit board, and a second connection electrode on a top surface opposite to the surface facing the circuit board. The first connection electrode is connected to a wiring pattern on the circuit board, and the second connection electrode is connected to the connection conductor and an outer electrode and is not connected to the wiring pattern.

The present disclosure discloses a multilayer circuit board comprising a plurality of metal layers, a blind via and/or a buried via, the multilayer circuit board is capable of transmitting signal between the different metal layers. The blind via has a pad on a non-opening side of the blind via. An upper or lower layer metal layer on the non-opening side of the blind via adjacent to the blind via has a first hole which is located in a position corresponding to the pad on the non-opening side of the blind via in a depth direction of the blind via; and/or an upper and/or lower layer adjacent to the buried via has a second hole which is located in a position corresponding to the pad of an upper and/or lower orifice of the buried via in a depth direction of the buried via.

Embodiments described herein relate to a method for modifying transmission line characteristics. The method may include: making a first determination of a null frequency of an input signal to a transmission line; performing an analysis to make a second determination of a wavelength of the input signal using, at least in part, the null frequency; making a third determination, based on the analysis, of a half wavelength of the input signal; calculating, based on the half wavelength, a total stub length; and adding a trace to a stub associated with a via, wherein the stub and the trace are a length that is at least a portion of the half wavelength of the input signal.

An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.

A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.