A flexible printed circuit board includes: a base film; a first circuit pattern disposed on an upper surface of the base film; a second circuit pattern disposed on a lower surface of the base film; and a boundary reinforcing pattern expanding the first circuit pattern in a width direction of the first circuit pattern based on a virtual boundary along which the first circuit pattern and the second circuit pattern meet each other in an overlay of the first circuit pattern and the second circuit pattern.

A printed circuit board includes an insulating layer; a recess portion disposed on one surface of the insulating layer; and a circuit layer disposed on the one surface of the insulating layer and including a signal pattern and a ground pattern. At least a portion of the ground pattern covers at least a portion of the recess portion.

A method for manufacturing a double-sided, single conductor laminate includes providing a laminated substrate that includes a conductive layer, an adhesive layer and a support layer; dry milling a trace pattern in the laminated substrate by removing selected areas of the conductive layer and the adhesive layer; and attaching a first cover layer using a first adhesive layer to the conductive layer. The first cover layer includes one or more precut access holes that align with one or more traces of the trace pattern.

A surge protective device (SPD) circuit system for providing overvoltage protection to an electrical power circuit includes a PCB assembly, an SPD module, and an SPD monitoring system. The PCB assembly selectively mountable on the PCB includes a PCB and a remote signal (RS) PCB contact on the PCB. The SPD module includes an overvoltage clamping element and an RS spring contact including an RS contact portion. When the SPD module is mounted on the PCB and the electrical power circuit is connected to the PCB: the PCB electrically connects the SPD module to the circuit and the overvoltage clamping element provides overvoltage protection to the circuit; the RS contact portion engages the RS PCB contact; the RS spring contact is elastically deflected and persistently loads the RS contact portion against the RS PCB contact; and the RS spring contact is electrically connected to the SPD monitoring system via the RS PCB contact.

A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.

An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.

Devices are disclosed that include a wideband millimeter wave (mmW) via transition design for multilayer printed circuit boards (MLBs). In various instances embodiments, a via is dimensioned to provide impedance matching to stripline tracing connected at the end of the via. Impedance matching in the via may eliminate the need for an impedance matching section on the stripline tracing. In some instances, the dimensions of the via pad diameter and the via keepout diameter are selected to tune a via transition structure to selected frequencies and/or frequency bandwidths.

A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. The body can have a top surface, a bottom surface opposite the top surface, and a plurality of side surfaces. The heat sink component also can include a heat source terminal formed over the bottom surface of the body. The heat source terminal can be spaced apart from the plurality of side surfaces. The heat sink component further can include a heat sink terminal formed over the bottom surface of the body. The heat sink terminal can be spaced apart from the plurality of side surfaces.

A printed circuit board (PCB), including: a processing unit; a plurality of layers; and a plurality of vias, each via extending through two or more of the layers, wherein a first via of the plurality of vias has a first pad at a first layer of the plurality of layers and a second via of the plurality of vias has a second pad at the first layer of the plurality of layers, wherein the first pad is conjoined with the second pad to form a first heatsink at the first layer that dissipates heat away from the processing unit.

A component-embedded substrate includes: insulating layers each including a wiring pattern; an embedded component including a connection terminal; a plurality of vias that electrically connect the connection terminal to the wiring patterns adjacent to each other in a lamination direction. Each of the vias is composed of a via hole in the insulating layer and a conductive material in the via hole. One of the vias is a connection via connected to the connection terminal, and another of the vias is an adjacent via adjacent to the connection via in the lamination direction. The connection via and adjacent via overlap in a plan view. S1/A1≤0.61 and S1/A2≤0.61 are satisfied, where A1 is an average cross-sectional area of the connection via, A2 is an average cross-sectional area of the adjacent via, and S1 is an overlapping area of the connection via and adjacent via in the plan view.