A voltage regulator module includes a first circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board, a plurality of switch elements and a first molding compound layer. The switch elements are mounted on a first surface of the first printed circuit board. The first molding compound layer is formed on the first surface of the first printed circuit board to encapsulate the switch elements. The magnetic core assembly is arranged beside a second surface of the first printed circuit board, and includes a magnetic core portion and at least one first U-shaped copper structure. The magnetic core portion includes a plurality of openings. Each first U-shaped copper structure is penetrated through two corresponding openings to define two inductors. A first terminal of each inductor and the corresponding switch element are connected in series to define a phase circuit.

A printed circuit board according to an embodiment includes: a first insulating portion having a cavity; a second insulating portion disposed on the first insulating portion; a third insulating portion disposed under the first insulating portion; and an electronic device disposed in the cavity, wherein a number of layers of the second insulating portion is different from a number of layers of the third insulating portion, and has an asymmetric structure with respect to the first insulating portion in which the electronic device is disposed.

A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.

A packaging method includes steps of: forming first and second wiring layers electrically connected to each other on two opposite surfaces of a substrate; then configuring mother substrate interconnecting bumps on the first wiring layer and along perimeter of a daughter substrate unit, and then cutting along the perimeter of the daughter substrate unit to expose lateral faces of the mother substrate interconnecting bumps and configuring solder materials thereon; then configuring first and second chips on the first and the second wiring layers to form electrical interconnection between the two chips. A package structure enables interconnecting two chips through one single daughter substrate unit with its wiring layers directly connecting with lateral face contacts of the mother carrier substrate through the mother substrate interconnecting bumps. Hence, area of the daughter substrate unit is reduced; lengths of the interconnection paths are shortened, and qualities of communication and space utilization are enhanced.

A component carrier for carrying electronic components, wherein the component carrier comprises an at least partially electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end, wherein the at least one electronic component is electrically contacted directly to the component contacting end, wherein at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure, and wherein the wiring contacting end is electrically contacted directly to the wiring structure.

Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.

A radio frequency module includes a plurality of insulating base material layers made of a thermoplastic resin defining a multilayer circuit board and including a cavity inside thereof, an IC chip disposed in the cavity and including a noise generation source, and planar ground conductive bodies provided in the multilayer circuit board. The planar ground conductive bodies are disposed on a layer not exposed to the inner surface of the cavity, and include inter-layer connection conductive bodies protruding in the direction of the noise generation source from the planar ground conductive bodies.

Some embodiments relate to an electronic package. The electronic package includes a substrate that includes a plurality of buildup layers. A first die is embedded in one of the buildup layers on one side of the substrate. A second die is bonded to the substrate within a cavity on an opposing side of the substrate. The first die and the second die may be electrically connected to conductors within the plurality of buildup layers. Other embodiments relate to method of connecting a first die to a second die to form an electronic package. The method includes attaching a first die to a core and fabricating a substrate onto the core. The method further includes creating a cavity in another of the buildup layers on an opposing side of the substrate and attaching a second die to the substrate within the cavity.

In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.