A glass core device with a wiring pattern on a first surface of a glass core and a wiring pattern on a second surface thereof being electrically connected via a wiring pattern embedded in TGVs formed in the glass core. In a state of being cut out by dicing, each glass core has a second surface and side faces which are continuously covered with an outer protective layer.

A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

A circuit board structure includes a first dielectric layer, at least one first circuit layer, a second dielectric layer, and an insulating protection layer. The first circuit layer is mounted on the first dielectric layer, and includes at least one first circuit. The second dielectric layer is mounted on the first circuit layer, and includes at least one thermally conductive bump and at least one electrically conductive bump. The electrically conductive bump is electrically connected to the first circuit. The insulating protection layer is mounted on the second dielectric layer. The thermally conductive bump directly contacts the glass substrate. When lasering is applied to cut the glass substrate for de-bonding, the lasering heat energy can be absorbed and dissipated by the thermally conductive bump, resolving the problem of circuit de-bonding and raising the process yield. In addition, a manufacturing method of the circuit board structure is provided.

A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.

A conductive glass substrate, and a system and a method for manufacturing the same are provided. The conductive glass substrate includes a glass substrate structure, a conductive base structure and a conductive extending structure. The glass substrate structure includes at least one through hole connected between a bottom surface and a top surface thereof. The conductive base structure is disposed on the bottom surface of the glass substrate structure. The conductive extending structure is electrically connected to the conductive base structure, and the conductive extending structure is extended from the conductive base structure to the top surface of the glass substrate structure along an inner surface of the at least one through hole. Hence, the conductive glass substrate can provide at least one conductive via so as to electrically connect an upper circuit and a lower circuit.

A component carrier with a stack including at least one electrically insulating layer structure and at least one electrically insulating structure has a tapering blind hole formed in the stack and an electrically conductive plating layer extending along at least part of a horizontal surface of the stack outside of the blind hole and along at least part of a surface of the blind hole. A minimum thickness of the plating layer at a bottom of the blind hole is at least 8 μm.

An implantable electrical connecting device includes a first elastic multi-ply layer and a second elastic multi-ply layer. The first elastic multi-ply layer has a first electrically conductive layer and a plurality of first electrical contacts electrically conductively connected to the first electrically conductive layer of the first elastic multi-ply layer. The second elastic multi-ply layer has a first electrically conductive layer and a plurality of second electrical contacts electrically conductively connected to the first electrically conductive layer of the second elastic multi-ply layer. The second electrical contacts make contact with the first electrical contacts.

A wiring board includes: a first insulating layer; a first pad region provided above the first insulating layer and having a first connection pad; a second insulating layer provided above the first connection pad and having a first opening to expose the first connection pad; a second pad region provided above the second insulating layer and having a second connection pad electrically connected to the first connection pad; and a third insulating layer provided above the second connection pad, and having a second opening to exposes the first and second connection pads. The first connection pad region is smaller than the second connection pad region.

A method for making a recess or opening in a planar workpiece with a thickness of less than 3 millimeters includes successively etching a plurality of flaws to form the recess or opening such that a contour of the recess or opening has a sequence of widenings and constrictions as a result of the etching.