A component carrier includes an electrically insulating layer structure, a first electrically conductive layer structure, a second electrically conductive layer structure, and a laser through-hole with an electrically conductive medium filling at least part of the through-hole. The first electrically conductive layer structure covers a first side of the electrically insulating layer structure and has a first window extending through the first electrically conductive layer structure formed by etching using a conformal mask. The second electrically conductive layer structure covers an opposed side of the electrically insulating layer structure and has a second window extending through the second electrically conductive layer structure formed by etching using a conformal mask. The laser through-hole extends through the electrically insulating layer structure. At least a portion of at least one sidewall of the electrically conductive layer structures delimiting the windows is tapered.

Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

A component carrier includes a stack with at least one electrically conductive layer structure and a plurality of electrically insulating layer structure, a first component, a second component, a central core in which both the first component and the second component are embedded. A first electrically insulating structure encapsulates the first component. A second electrically insulating structure encapsulates the second component. The first component and the second component are electrically connected to an external electrically conductive structure through at least one electrically conductive contact passing through the first electrically insulating structure and/or the second electrically insulating structure.

A circuit board structure, including a circuit layer, a first dielectric layer, a first graphene layer, a first conductive via, and a first built-up circuit layer, is provided. The circuit layer includes multiple pads. The first dielectric layer is disposed on the circuit layer and has a first opening. The first opening exposes the pads. The first graphene layer is conformally disposed on the first dielectric layer and in the first opening, and has a first conductive seed layer region and a first non-conductive seed layer region. The first conductive via is disposed in the first opening. The first built-up circuit layer is disposed corresponding to the first conductive seed layer region. The first built-up circuit layer exposes the first non-conductive seed layer region and is electrically connected to the pads through the first conductive via and the first conductive seed layer region.

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

A method for manufacturing a wiring board according to the present disclosure includes: in the following order, (a) a step of irradiating an insulating layer composed of a resin composition with active energy rays; (b) a step of adsorbing an electroless plating catalyst to the insulating layer; and (c) a step of forming a metal layer on a surface of the insulating layer by electroless plating, in which in the step (a), a modified region having a thickness of 20 nm or more in a depth direction from the surface of the insulating layer and voids communicating from the surface of the insulating layer is formed by irradiation of the active energy rays.

A wiring board according to the present disclosure includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring, in which the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.

The disclosure provides a circuit board structure including at least two sub-circuit boards and at least one connector. Each of the sub-circuit boards includes a plurality of carrier units. The connector is connected between the sub-circuit boards, and a plurality of stress-relaxation gaps are defined between the sub-circuit boards.

A connection body for use with an endoscope that provides an electrical connection between at least one electrical component arranged in a proximal end region of the endoscope and an internal electrical connection provided in the proximal end region. The connection body including: a dimensionally stable three-dimensional circuit carrier: and a flexible elongate circuit board. Where, in a first region of the circuit carrier, the electrical component is mechanically directly connected to the circuit carrier and is contacted by conductor tracks provided in the circuit carrier; in a second region different from the first region, a first end of the circuit board is mechanically directly connected to the circuit carrier and contacts the conductor tracks for electrical connection to the electrical component and a second end of the circuit board opposite the first end in a longitudinal direction of the circuit board, contacts the internal electrical connection.

A component carrier includes a base structure with component carrier material and forming a cavity, a component embedded in the cavity, a first electrically insulating layer structure connected to a front side of the base structure and to the component and at least partially filling a gap between the component and the base structure, and a second electrically insulating layer structure connected to the first electrically insulating layer structure at a connection surface of the first electrically insulating layer structure. The connection surface opposes an opposing surface of the second electrically insulating layer structure faces away from the first electrically insulating layer structure.