A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.

The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and formation of a conductor pattern on at least the one outer surface of the core on which the component is arranged, as well as the interconnecting paths between the contacts and the conductor pattern, and Removal of the areas of the conductor layer not belonging to the conductor pattern.

A method for forming a resist fine pattern uses inkjet printing for printing an ink along a path to form a resist fine pattern on a substrate having the same surface energy. The method includes an ejecting step of simultaneously discharging a photocurable resist ink and a partition-forming ink that are spaced from each other on the front side and the rear side of the path and applying the light energy to the discharged photocurable resist ink. The intensity of light is set so that, as the photocurable resist ink is semi-cured and is ejected on the substrate in a gelatinous state, the ink forms a boundary that is vertical with respect to the partition-forming ink ejected on the substrate and the spreading of the photocurable resist ink is prevented, and the photocurable resist ink is cured after both the photocurable resist ink and the partition-forming ink are completely ejected.

A polypeptide including a region A, a region B, and a region C, a photoresist composition including the polypeptide, and a method of forming patterns by using the photoresist composition.

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

A photosensitive resin composition comprises a component (A): a resin having a phenolic hydroxyl group; a component (B): an aliphatic compound having two or more functional groups, the functional groups being one or more group selected from an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group and a hydroxyl group; a component (C): a photosensitive acid generator; and a component (D): an inorganic filler having an average particle diameter of 100 nm or less.

An electrical device, comprising a softening polymer layer, an electrode layer on a surface of the softening polymer layer and a cover polymer layer on the surface of the softening polymer layer. An opening in the polymer cover layer is filled with a reflowed solder, one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer, and another end of the reflowed solder contacts an electrical connector electrode of the device.

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

A circuit board includes a plurality of first insulating base materials and a plurality of second insulating base materials that are alternately laminated, a first metal layer being formed into a pattern shape on a first surface of the first insulating base material, and a second metal layer being formed into a pattern shape on a second surface of the first insulating base material. The first metal layer is formed into a trapezoidal shape that is large in diameter on a first surface side of the first insulating base material. The second metal layer is formed into a trapezoidal shape that is large in diameter on a second surface side of the first insulating base material. The first metal layers and the second metal layers are laminated in such a manner that the trapezoidal shapes are alternately oriented.