The present invention is related to a composition for micro etching of a copper or a copper alloy surface, wherein the composition comprises i) at least a source of Fe.sup.3+ ions, ii) at least a source of Br.sup.− ions, iii) at least an inorganic acid, and iv) at least one etch refiner according to formula I

##STR00001## wherein R1 is selected from the group consisting of hydrogen, C.sub.1-C.sub.5-alkyl or a substituted aryl or alkaryl group; R2 is selected from the group consisting of hydrogen, C.sub.1-C.sub.5-alkyl or C.sub.1-C.sub.5-alkoxy; R3, R4 are selected from the group consisting of hydrogen and C.sub.1-C.sub.5-alkyl; and X.sup.− is a suitable anion. Further, the present invention is directed to a method for micro etching of copper or copper alloy surfaces using such a composition.

A wiring board includes an insulating layer; an insulating oxide film that is formed by forming a film of metal oxide or semimetal oxide on a surface of the insulating layer; a seed layer that is made of metal and that is stacked on the insulating oxide film; and an electrode that is made of metal and that is formed on the seed layer, wherein the insulating oxide film and the seed layer are removed from an area not overlapping the electrode to expose the insulating layer.

The object of the present invention is to provide a printed circuit board that improves the heat radiating effect as the entire printed circuit board and a manufacturing method for such a printed circuit board. A printed circuit board includes a base member having two main surfaces, at least one heat-radiating conductor layer formed on at least one of the main surfaces of the two main surfaces of the base member and a solder resist layer formed on a surface of the heat-radiating conductor layer, and in this printed circuit board, the heat-radiating conductor layer has two main surfaces and at least one side face, the heat-radiating conductor layer has its one main surface of the two main surfaces made in planar contact with the main surface of the base member, the solder resist layer further has an etching liquid resistance, and is formed on the other main surface of the two main surfaces of the heat-radiating conductor layer, with the side face of the heat-radiating conductor layer being exposed, and the heat-radiating conductor layer and the solder resist layer are allowed to form a laminate 24 having a substantially convex shape with an appropriate height.

[Object] Provided are a laminate film and an electrode substrate film with excellent etching quality, in which a circuit pattern formed by etching processing is less visible under highly bright illumination, and a method of manufacturing the same.

[Solving Means] A laminate film includes a transparent substrate 60 formed of a resin film and a layered film provided on at least one surface of the transparent substrate. The layered film includes metal absorption layers 61 and 63 as a first layer and metal layers (62, 65), (64, 66) as a second layer, counted from the transparent substrate side. The metal absorption layers are formed by a reactive sputtering method which uses a metal target made of Ni alone or an alloy containing two or more elements selected from Ni, Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, and Cu, and a reactive gas containing oxygen. The reactive gas contains hydrogen.

A method of manufacturing metallic articles (6) including the steps of: —applying a radiation curable composition comprising a monomer including at least two polymerisable groups on a surface of a substrate thereby forming an image (2); —curing the image; —plating (4) or etching (3) a surface of the substrate not covered by the cured image by means of an alkaline solution; —removing (5) the cured image by means of an acidic solution; characterized in that a linking group between the polymerisable groups comprises at least one acid degradable or hydrolysable group selected from the group consisting of an acetal, a ketal, an orthoester, an orthocarbonate, a tertiary ester, a tertiary carbonate and a tertiary urethane and wherein the composition further comprises less than 10 wt % of other monomers including at least two polymerisable groups relative to the total weight of the polymerisable composition.

Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.

A manufacturing method of a circuit board and a stamp are provided. The method includes the following steps. A circuit pattern and a dielectric layer covering the circuit pattern are formed on a dielectric substrate. A conductive via connected to the circuit pattern is formed in the dielectric layer. A photoresist material layer is formed on the dielectric layer. An imprinting process is performed on the photoresist material layer using a stamp to form a patterned photoresist layer, wherein the pressing side of the stamp facing the circuit pattern becomes sticky when subjected to pressure so as to catch photoresist residue from the photoresist material layer in the imprinting process. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed.

A photosensitive res in composition includes (A) a binder polymer having a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms, and a structural unit derived from a (meth)acrylic acid; (B) a photopolymerizable compound having an ethylenically unsaturated bond group; (C) a photopolymerization initiator; and (D) a styryl pyridine represented by the Formula (1). In Formula (1), each of R.sup.1, R.sup.2 and R.sup.3 independently represents an alkyl group having from 1 to 20 carbon atoms, an alkoxy group having from 1 to 6 carbon atoms, an alkyl ester group having from 1 to 6 carbon atoms, an amino group, an alkyl amino group having from 1 to 20 carbon atoms, a carboxy group, a ciano group, a nitro group, an acetyl group or a (meth)acryloyl group, each of a, b and c independently represents an integer of from 0 to 5. In a case in which each of a, b and c is independently 2 or more, the plural R.sup.1s, R.sup.2s, and R.sup.3s independently may be the same or different.

##STR00001##

A photosensitive resin composition comprises: a resin having a phenolic hydroxyl group; a photosensitive acid generator; a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and at least one selected from the group consisting of a methylol group and an alkoxyalkyl group; and an aliphatic compound having two or more functional groups, the functional groups being at least one functional group selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group, wherein the photosensitive acid generator is a sulfonium salt containing an anion having at least one skeleton selected from the group consisting of a tetraphenylborate skeleton, an alkylsulfonate skeleton having 1 to 20 carbon atoms, a phenylsulfonate skeleton and a 10-camphorsulfonate skeleton.

A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the first Cu foil layer and the second Cu foil layer may include double Cu foils which are physically attached together.