A stencil printer for printing an assembly material on an electronic substrate includes a frame, a stencil coupled to the frame, the stencil having apertures formed therein, a support assembly coupled to the frame, the support assembly being configured to support the electronic substrate, a print head gantry coupled to the frame, and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The stencil printer further comprises a verification system to determine whether an item placed within the stencil printer is properly installed within the stencil printer.

It is an object of the present invention to provide a printed circuit board capable of accurately detecting disconnections of circuit patterns with an automatic circuit pattern inspecting device even when positions of mounting lands are slightly deviated from normal positions due to manufacturing errors. For solving this object, the printed circuit board of the present invention is provided with a first mounting land 4a and a second mounting land 4b, and a first circuit pattern 6a and a second circuit pattern 6b on a surface thereof, wherein a first electric checker land 10a and a second checker land 10b which are electrically connected with the first mounting land 4a and the second mounting land 4b are provided on a surface of a wiring board 2.

A method for printing conductive solder paste on a base substrate to establish an electrical connection is provided. The method includes applying conductive solder paste over a stencil, and within an opening of the stencil to contact the base substrate therebeneath. In embodiments, a squeegee can be used to scrape some of the conductive solder paste off of the stencil, leaving behind some of the conductive solder paste within the opening. Subsequently, the stencil can be removed at a speed of more than 200 millimeters per second to help reduce the end-of-track bump ultimately formed at the end of the conductive solder paste that remains after the stencil is removed.

A tensioning frame for tensioning a printing screen comprises struts to reinforce the constituent beams. These may be provided either on a supplementary brace plate or integrally formed with the beam. A shaft may be used to retain engagement bodies within pockets formed in the beam.

Disclosed herein are implementations of methods and devices for stacking printed circuit board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on surface mount technology (SMT) component and solder joint reliability.

Aspects of the invention include receiving a printed circuit board (PCB) having one or more of mounting pads thereon, determining a stencil for applying a solder paste to the one or more mounting pads, the stencil having a smallest aperture for a component requiring a standoff, determining a maximum threshold size for standoff particles based on the smallest aperture, determining a first concentration of the standoff particles based on the smallest aperture, determining a minimum threshold size for standoff particles to create the standoff for the component, determining a second concentration of the standoff particles to create a three-standoff seating plane for the component, introducing the standoff particles to the solder paste, the standoff particles in the solder paste having a concentration between the first concentration and the second concentration, and a size between the maximum threshold size and the minimum threshold size.

A system for normalizing the solder interconnects (e.g., normalizing the height of the solder ball interconnects) in a circuit package module (e.g., dual-sided mold grid array package module) after removal from a test board includes a fixture that receives the circuit package module upside down and a stencil removably coupleable to the fixture and over the circuit package module. The stencil has a pattern of apertures that coincides with the pattern of solder interconnects of the circuit package module. Solder paste can be applied over the stencil to pass through the apertures to add solder paste to the solder interconnects. The stencil can be removed from over the fixture, and the circuit package module removed from the fixture. The circuit package module can be heated to reflow the solder interconnects with the added solder paste.

The restretchable stencil frame according to the present invention consists of a metallic stencil foil mounted on a rectangular frame fabricated of tubular material or C-channel. Each corner of the frame is provided with one screw-actuated conical expander and one counterplate serving to biaxially tension the stencil foil. To ensure uniform stretching of the stencil foil, areas of increased elasticity are provided to the corners of the frame and to the foil itself in the form of oriented slots, cuts, holes and combination thereof.

It is an object of the present invention to provide a printed circuit board capable of accurately detecting disconnections of circuit patterns with an automatic circuit pattern inspecting device even when positions of mounting lands are slightly deviated from normal positions due to manufacturing errors.

For solving this object, the printed circuit board of the present invention is provided with a first mounting land 4a and a second mounting land 4b, and a first circuit pattern 6a and a second circuit pattern 6b on a surface thereof, wherein a first electric checker land 10a and a second checker land 10b which are electrically connected with the first mounting land 4a and the second mounting land 4b are provided on a surface of a wiring board 2.

A template or stencil with perforations, which improves solder-paste stencilling on an object, includes: a first area treated with precision powder on a bottom laminar face of the template, the treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, the second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, the third area encircling the perforations of the template. A method for producing a template that improves solder-paste stencilling on an object is also provided, as is and to a method for the improved application of solder-paste on an object, such as a printed circuit board.