Methods and devices that identify a silkscreen data file associated with a physical printed circuit board and use an image of the physical printed circuit board to display a virtual silkscreen over the image of the physical printed circuit board.

The invention relates to a template or stencil with perforations, which improves solder-paste stencilling on an object and comprises: a first area treated with precision powder on a bottom laminar face of the template, said treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, said second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, said third area encircling the perforations of the template. The invention also relates to a method for producing a template that improves solder-paste stencilling on an object, and to a method for the improved application of solder-paste on an object, such as a printed circuit board.

A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

A PCB stencil manufacturing method and system. The method comprises: inputting PCB stencil design information in a preset input format, the PCB stencil design information comprises solder pad element information; and converting the PCB stencil design information into corresponding system core data information, the system core data information comprises solder pad element packaging information, and the solder pad element packaging information comprises a solder pad element packaging pattern and solder pad element coordinates; and querying a stencil opening database according to the solder pad element packaging pattern, records in the stencil opening database comprise the following attributes: a solder pad element packaging pattern and a stencil opening pattern; and placing a stencil opening pattern corresponding to a matching solder pad element packaging pattern to an opening layer according to the solder pad element coordinates.

A screen-printing machine includes a mask holding device; a board holding device configured to grip a board; a positioning device to relatively position the board and the mask; and a control device. The board holding device includes a lifting and lowering table positioned in an up-down direction by a lifting and lowering mechanism, and a backup block including a mounting surface on which the board is placed, an installation surface disposed parallel to the mounting surface on an opposite side thereof, multiple suction holes to penetrate in a thickness direction between the mounting surface and the installation surface, and a chamber recessed section formed on an installation surface side so as to surround positions of the multiple suction holes, and in which an air chamber made by the chamber recessed section is configured when the backup block overlaps an upper face of the lifting and lowering table.

A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.

Methods and devices that identify a silkscreen data file associated with a physical printed circuit board and use an image of the physical printed circuit board to display a virtual silkscreen over the image of the physical printed circuit board.

A division mask includes a main body including at least one opening pattern, and a clamping portion at an edge of the main body, the clamping portion having an increasing width with respect to an increasing distance from the main body, and the clamping portion including a fan-out portion extending from the main body and including at least one dummy pattern, and at least one branch portion having a decreasing width with respect to an increasing distance from the fan-out portion.

The present invention relates to a method for nanomodulating metal films by means of high-vacuum cathode sputtering of metals, and to stencils of anodized Al. As an example of the use of these nanomodulated metal films, the synthesis or production of a magnetically weak film by means of cathode sputtering, which film can he used as a magnetic field sensor, and a metal nanomodulated stencil are analyzed.

In solder printer, solder supply device uses positive and negative pressure supply device to apply pressure inside air chamber to move solder cup inside outer tube, such that solder paste is supplied from supply nozzle. Controller, when supply of solder paste from supply nozzle is stopped, performs drive control of positive and negative pressure supply device to decrease the pressure inside air chamber, and uses timer to measure the time required from the starting of decreasing the pressure inside the air chamber to when the pressure inside air chamber has reached a set pressure. Because this required time corresponds to the movement amount of solder cup from the start of supply of the solder paste to when supply is stopped, controller using the measured required to estimate the remaining amount of the solder paste in detail with good accuracy.