A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.

A screen printing apparatus includes a squeegee driver that lifts/lowers a first lifting/lowering shaft and a second lifting/lowering shaft; a link mechanism including a swinging member that pivots about a horizontal axis by lifting/lowering operations of the first lifting/lowering shaft and the second lifting/lowering shaft; a squeegee unit installed to the swinging member; and a controller that controls at least a height of the squeegee unit and an orientation of the squeegee unit in a rotating direction by controlling the squeegee driver.

A printing device includes a controller configured or programmed to acquire, based on a width of a coating material that has been measured, at least one of a start position, an end position, or an amount of movement of a coating material scooping unit in coating material scooping operation.

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for producing meander-line polarizers. In some implementations, a meander-line polarizer includes a dielectric substrate made of a polyester polymer material and meander-line arrays formed on a surface of the dielectric substrate. Each meander-line array includes a sequence of alternating perpendicular conductive traces that are formed the surface of the dielectric substrate by applying conductive ink to the surface of the dielectric substrate using a template that defines a location and dimensions of each conductive trace of each meander-line array.

A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.

In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.

A printing system for printing substrates, in particular circuit boards, such as wafer and solar cells, has a printing device, with a printing table on which the substrate can be positioned and a print head associated with the printing table for printing the substrates positioned on the printing table, has a feed device for feeding the substrates to be printed to the printing device, a discharge device for discharging the printed substrates from the printing device, and a plurality of substrate supports on which each of the plurality of substrates can be supported. The feed device, printing device and discharge device convey the substrate supports with the substrates located thereon. The feed device collects plurality of substrate supports and feeds them to the printing device. The printing device prints the substrates on the collected substrate supports, and the discharge device separates and discharges these collected substrate supports.

The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the solder paste tub through an opening of the solder paste tub, wherein solder paste is accommodated in the housing of the solder paste tub; bearing the solder paste tub, with the opening facing downward, on a working platform by means of the solder paste nozzle; holding the solder paste tub by mating a holder with an engagement means on an outer wall of the housing of the solder paste tub, the holder being capable of moving up and down with the housing of the solder paste tub; and pressing the housing of the solder paste tub, such that the housing of the solder paste tub moves relative to the solder paste nozzle, at the same time causing the holder to move as the housing of the solder paste tub moves, so as to extrude solder paste accommodated in the housing of the solder paste tub from the solder paste nozzle.

A printing device includes a coating material scooping unit configured to scoop a coating material on a mask, and a controller configured or programmed to determine whether or not the coating material scooping unit performs collecting operation to collect the coating material on the mask when the mask is replaced.

A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.