A circuit forming method for forming a circuit with a curable resin and a conductive fluid, the method including a setting step of setting errors that occur during a circuit forming work to an automatic release error and a non-release error for each type of error, the automatic release error being to be automatically released, and the non-release error being not to be automatically released, a determination step of determining whether an error has occurred in work when the circuit is formed, and a re-execution step of automatically re-executing work determined that the error has occurred in the determination step, in a case where the error of the work is set to the automatic release error in the setting step.

A device including an electrically conducting track arranged on a support includes a step of supply of the support, and a step of formation of the electrically conducting track on the support including a step of supply of a solution intended to be deposited on the support, a step of deposition of the solution by printing on the support. The step of supply of the solution is such that the solution supplied includes a mixture of a solvent, of a set of metal particles and of a metallic material having a melting point below that of the metal particles of the set of metal particles, and the method includes a step of melting of the metallic material which results in the formation of a solder of metallic material between metal particles of the set of metal particles.

A deposition device is described. The deposition device has a substrate support and a laser imaging system disposed to image a portion of a substrate positioned on the substrate support. The laser imaging system comprises a laser source and an imaging unit, and is coupled to a deposition assembly disposed across the substrate support.

A method for mounting a component (100) on a workpiece (106), the method comprising obtaining information regarding a surface topography of at least one of a mounting surface (102) of the component and a local surface (108) of the workpiece onto which the component is to be mounted. The method further comprises forming a plurality of deposits (110) of a viscous medium on at least one of the mounting and local surfaces, wherein each of the plurality of deposits has a height (/½, /½, h3) based on the obtained information, and is formed by individually applying at least one droplet (234) of the viscous medium (232) using non-contact dispensing. The method further comprises placing the component on the substrate, such that the plurality of deposits of viscous medium forms a connection between the component and the workpiece.

A method of 3D printing in which a 3D product is built up layer by layer by jetting from print heads includes forming part of a 3D product by a functional binder jetting process; jetting one or more material in a 2D pattern to form a structure on said part; completing the formation of the 3D product by continuing the functional binder jetting process, so that said structure becomes embedded in said product. Functional binder jetting may include: providing a layer of a powder bed; jetting a functional binder onto selected parts of said layer, wherein said functional binder infiltrates into pores in the powder bed and locally fuses particles of the powder bed in situ; sequentially repeating applying a layer of powder on top and selectively jetting functional binder, multiple times, to provide a powder bed bonded at selected locations by printed functional binder.

A metallic nanoparticle composition includes metallic nanoparticles and a non-aqueous polar protic solvent. The non-aqueous polar protic solvent has two hydroxyl groups, a boiling point of at least 280° C. at 760 mm Hg, and a viscosity in a range of 45 cP to 65 cP at 20° C. Polyvinylpyrrolidone (PVP) is present on the metallic nanoparticle surfaces. A concentration of metals in the metallic nanoparticle composition is in a range of 60 wt% to 90 wt% and a concentration, in aggregate, of solvents having a boiling point of less than 280° C. at 760 mm Hg in the metallic nanoparticle composition does not exceed 3 wt%.

A conductive element such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smartphones, personal digital assistants (PDAs), laptops, and wireless tablets, and methods of, and apparatus for, forming the same. In one exemplary aspect, the present disclosure relates to a conductive antenna formed using deposition of conductive fluids as well as the method and equipment for forming the same. In one embodiment, a complex (3D) conductive trace is formed using two or more different print technologies via creation of different domains within the conductive trace pattern.

The present invention relates to a device (1) for enabling high-viscosity conductive and dielectric printing fluids, that are used in commercial and experimental flexible circuit manufacturing practices and included at the universal or experimental development stage, to be printed automatically in compliance with the flexible circuit diagram desired to be printed and without using a flexible base material.

To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.

The inventive concepts relate to a method of manufacturing a hybrid metal pattern and a hybrid metal pattern manufactured thereby. In the method, the hybrid metal pattern may be manufactured on a substrate (e.g., a flexible substrate), formed of various materials, at room temperature without damaging the substrate, by a wire explosion method in liquid and light-sintering. In more detail, when performing the wire explosion method in liquid according to conditions of the inventive concepts, metal particles having uniform nano-sizes and uniform micro-sizes can be formed by a simple process, and additional dispersing and collecting processes can be omitted. In addition, conductive hybrid ink is formed by adding a metal precursor and then is light-sintered. In this case, the hybrid metal pattern can be manufactured by a very simple process.