The disclosure relates to systems and methods for using additive manufacturing (AM) to fabricate printed circuits having side-mounted components and contacts. More specifically, the disclosure is directed to additive manufacturing methods for fabricating electronic components (AME), for example; printed circuit board (PCB), flexible printed circuit (FPC) and high-density interconnect printed circuit board (HDIPCB) (the PCBs, FPCs, and HDIPCB's together referred to as AMEs, or AME circuits), having conductive contacts and/or components along the Z axis of side walls or facets of the each of the printed AMEs.

The development of stretchable, mechanically and electrically robust interconnects by printing an elastic, silver-based composite ink onto stretchable fabric. Such interconnects can have conductivity of 3000-4000 S/cm and are durable under cyclic stretching. In serpentine shape, the fabric-based conductor is enhanced in electrical durability. Resistance increases only ˜5 times when cyclically stretched over a thousand times from zero to 30% strain at a rate of 4% strain per second due to the ink permeating the textile structure. The textile fibers are wetted with composite ink to form a conductive, stretchable cladding of the silver particles. The e-textile can realize a fully printed, double-sided electronic system of sensor-textile-interconnect integration. The double-sided e-textile can be used for a surface electromyography (sEMG) system to monitor muscles activities, an electroencephalography (EEG) system to record brain waves, and the like.

The present invention relates to a multi-functional platform, including: a printed circuit board (PCB) having a single chip integrated thereon; wherein the single chip includes a substrate having an environmental system disposed thereon, the environmental system including a plurality of three-dimensional (3D) printed, patterned and multi-layered nanostructures disposed on the substrate. The nanostructures include an on-chip heater, a power source, a wireless communication module, and a plurality of sensors, the sensors including at least one of a gas sensor, a pressure sensor, or a temperature sensor, each of which is directly deposited on the substrate and printed with a plurality of nanomaterials. The 3D patterned nanostructures use functionalized nanomaterials, which are patterned by a template using one of directed assembly or nano-offset printing, to deposit the nanostructures directly on the substrate of the single chip.

The disclosure relates to systems and methods for fabricating passive RC frequency filter. More specifically, the disclosure is directed to computerized systems and methods for using additive manufacturing (AM) of simultaneous deposition of conductive and dielectric inks to form passive RC frequency pass filters having predetermined cutoff frequency with wide stop band frequency.

In a method for manufacturing a display panel according to an embodiment, a first anisotropic conductive layer is formed by ejecting a first anisotropic conductive layer forming material in order to bond the circuit board to the display panel, a reinforced curing layer is formed by ejecting a reinforced curing layer forming material onto a side surface of the first anisotropic conductive layer, a second anisotropic conductive layer is formed by ejecting a second anisotropic conductive layer forming material to an inner side of the second anisotropic conductive layer and the reinforced curing layer in order to bond the display drive integrated circuit, and a pixel is formed by ejecting a material for pixel printing to an inner side of the second anisotropic conductive layer for fixing the display drive integrated circuit.

Systems and methods for bonding an electronic component to substrate with a rough surface. The method comprising: disposing an insulating adhesive on the substrate; applying heat and pressure to the insulating adhesive to cause the adhesive to flow into at least one opening formed in the substrate; curing the insulating adhesive to form a pad that is at least partially embedded in the substrate and comprises a planar smooth surface that is exposed; disposing at least one trace on the planar smooth surface of the pad; depositing an anisotropic conductive material on the pad so as to at least cover the at least one trace; placing the electronic component on the pad so that an electrical coupling is formed between the electronic component and the at least one trace; and bonding the electronic component to the substrate by curing the anisotropic conductive material.

A three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The apparatus identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The apparatus identifies the via holes in the substrate and positions an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

When a specification setting unit sets a specification of a lot number “k+1” after setting a specification of a lot number “k”, a mounting program selector performs a mounting program corresponding to the lot number “k”, and then selects a mounting program corresponding to the lot number “k+1” according to matching between a mounting number from the mounting program and a planned number of products of the lot number “k”. A printing program selector selects a printing program corresponding to the lot number “k”, and then selects a printing program corresponding to the lot number “k+1” according to matching between a sum of a printing number from the printing program and a defective product number and the planned number of products of the lot number “k”. Consequently, on-demand production of an electronic device can easily be manufactured on a manufacturing line.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)
0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2) The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.