There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

Methods are provided to fabricate thick-film pastes with low cost by using base metals. The pastes achieve high conductivity and are sintered at low or high temperatures in the air. Therein, an aluminum powder is cladded with copper particles in a thickness of tens of nanometers to several microns for obtaining a copper-clad aluminum paste with high conductivity. The copper particles can be reduced with silver. A nanoscale silver-clad aluminum powder has a sintering temperature down to about 350 celsius degrees. Hence, the PCB electroplating copper electrode can be replaced to expel the expensive yellow-light development. The problem of solution pollution during electroplating is solved. Nevertheless, the expensive metal silver electrode used in screen printing can be replaced. The problem of the expensive required reduction atmosphere in screen printing can be solved as well. Thus, the material cost is significantly reduced for PCB substrates or ceramic substrates.

Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

A ceramic circuit board includes an insulating substrate composed of stacked insulating layers of an alumina-based sintered body, internal leads containing Cu embedded in the insulating substrate, and one or a plurality of metal layers containing Cu embedded in the insulating substrate, at least one of the metal layers being located nearer than the internal leads to the surface of the insulating substrate in the stacking direction, wherein at least part of the metal layer overlaps the internal leads in plan view.

To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.

The present invention focuses on a silicon nitride substrate having high mechanical strength, high thermal conductivity and the like, and takes advantage of such properties to provide: a ceramic substrate capable of providing improvement in a bonding property between a silicon nitride substrate and a ceramic layer which uses a dielectric ceramic material capable of being simultaneously sintered with a low-resistance conductive material such as a low-melting metal (Ag or Cu); and a method for producing the ceramic substrate. The ceramic substrate of the present invention is obtained by stacking and bonding a silicon nitride substrate and a ceramic layer composed of a dielectric ceramic material, wherein: the dielectric ceramic material contains Mg, Al, and Si as main ingredients, and Bi or B as an accessory ingredient; and the ceramic layer includes a region with a high Si element concentration at a bonding interface with the silicon nitride substrate.

A thick film paste comprising at least one particulate platinum (alloy), at least one metal compound, and an organic vehicle, wherein the at least one metal compound is selected from the group consisting of in each case particulate NiO, SiO.sub.2, RuO.sub.2, Rh.sub.2O.sub.3, IrO.sub.2, Cu.sub.2O, CuO, TiO.sub.2, ZrO.sub.2, PbO, SnO.sub.2, CeO.sub.2, Al.sub.2O.sub.3, MgO, MnO.sub.2 and MoO.sub.2, and metal compounds capable of forming a metal oxide on firing, the metal oxide being selected from the group consisting of NiO, SiO.sub.2, RuO.sub.2, Rh.sub.2O.sub.3, IrO.sub.2, Cu.sub.2O, CuO, TiO.sub.2, ZrO.sub.2, PbO, SnO.sub.2, CeO.sub.2, Al.sub.2O.sub.3, MgO, MnO.sub.2 and MoO.sub.2.

A printed circuit board according to an embodiment of the present invention includes a base film containing, as a main component, a polyimide and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film. An external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film.

One aspect relates to a multi-contact electrode, a method for manufacturing a multi-contact electrode, and a use of such multi-directional multi-contact electrode. The multi-contact electrode includes a support structure and a plurality of electrically conductive electrode segments. The support structure is made of a ceramic material. The electrode segments are made of a cermet material and are supported by the support structure. The electrode segments are distributed over an outer surface of the multi-contact electrode to form a multi-directional multi-contact electrode.