The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.

Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 m in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30 C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.

A circuit board includes a first conductive circuit layer, a cover layer, and a second conductive circuit layer. The cover layer includes an adhesive layer and a base film. The first conductive circuit layer is embedded within the adhesive layer. One side of the first conductive circuit layer is revealed from the adhesive layer. The second conductive circuit layer is located on a side of the base film facing away from the adhesive layer. The cover layer defines a first through hole and a second through hole passing through the cover layer. A diameter of the first through hole is greater than a diameter of the second through hole. The first through hole is filled with a copper post adjacent to the first conductive circuit layer and an electroplating layer adjacent to the second conductive circuit layer. The second through hole is filled with the electroplating layer.

A photosensitive resin composition comprises: a resin having a phenolic hydroxyl group; a photosensitive acid generator; a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and at least one selected from the group consisting of a methylol group and an alkoxyalkyl group; and an aliphatic compound having two or more functional groups, the functional groups being at least one functional group selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group, wherein the photosensitive acid generator is a sulfonium salt containing an anion having at least one skeleton selected from the group consisting of a tetraphenylborate skeleton, an alkylsulfonate skeleton having 1 to 20 carbon atoms, a phenylsulfonate skeleton and a 10-camphorsulfonate skeleton.

Provided herein is a method to printed electronics, and more particularly related to printed electronics on flexible, porous substrates. The method includes applying a coating compound comprising poly (4-vinylpyridine) (P4VP) and SU-8 dissolved in an organic alcohol solution to one or more surface of a flexible, porous substrate, curing the porous substrate at a temperature of at least 130 C. such that the porous substrate is coated with a layer of said coating compound, printing a jet of a transition metal salt catalyst solution onto one or more printing sides of the flexible, porous substrate to deposit a transition metal salt catalyst onto the one or more printing sides, and submerging the substrate in an electroless metal deposition solution to deposit the metal on the flexible, porous substrate, wherein the deposited metal induces the formation of one or more three-dimensional metal-fiber conductive structures within the flexible, porous substrate.

A method for creating patterned coatings on a molded article includes providing a molded article which has a surface comprising a first area and a second area, at least one surface property in the first area of the surface being different from that in the second area, applying a coating covering at least the first area and the second area to the surface of the molded article, the adhesion of said coating being greater in the first area than in the second area because of the at least one different surface property, and partially removing the coating by means of a removal process which is applied to the entire coating at a constant removal power that is determined such that the entire coating is removed in the second area while the coating remains in place on an entire surface of the first area.

A flexible printed circuit board includes a base layer and a pattern line. At least one communication hole penetrating opposite surfaces of the base layer. The pattern line includes two conductive circuit layers formed on the opposite surfaces of the base layer. At least one conductive pole are formed in the at least one communication hole and electrically connects the two conductive circuit layers. A gap being is formed between the conductive pole and the base layer.

A process includes utilizing a pin array that includes multiple segmented pins for forming selectively plated through holes. The process includes forming a PCB laminate structure that includes multiple spinel-doped core layers and multiple through holes. Each spinel-doped core layer includes a heat-activated spinel material incorporated into a dielectric material. The process includes aligning individual segmented pins of a pin array with corresponding through holes of the PCB laminate structure, where each segmented pin includes heated segment(s) and insulating segment(s). The process includes inserting the segmented pins of the pin array into the corresponding through holes and generating heat within each heated pin segment that is sufficient to form metal nuclei sites in selected regions of the spinel-doped core layers adjacent to portions of the through holes that contain the heated pin segments. The metal nuclei sites function as seed layers to enable formation of selectively plated through holes.

A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.

A wiring substrate includes a substrate containing a resin as a main component and including a mixed layer in which the resin and a catalyst are mixed together; and a metal wire disposed to cover the mixed layer and being in contact with the catalyst. The wiring substrate with such a configuration can increase the adhesion of the metal wire to the substrate.