A method for manufacturing a wiring board is capable of forming a metal layer included in a wiring layer to have an even thickness. The method includes preparing a conductive first underlayer on a surface of a substrate; a conductive second underlayer on a surface of the first underlayer; and a seed layer on a surface of the second underlayer and containing metal. The method disposes a solid electrolyte membrane between an anode and the seed layer as a cathode; applies voltage between the anode and the first underlayer to form a metal layer on the surface of the seed layer; removes an exposed portion of the second underlayer without the seed layer from the substrate; and removes an exposed portion of the first underlayer without the seed layer from the substrate. The first underlayer is a material having a higher electrical conductivity than that of the second underlayer.

An electronic device is provided. The device comprises a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate. The substrate comprises a polymer composition that includes an aromatic polymer and an electrically conductive filler, wherein the polymer composition exhibits a surface resistivity of from about 1×10.sup.12 ohms to about 1×10.sup.18 ohms as determined in accordance with ASTM D257-14.

A method for manufacturing circuit board, including: providing a substrate; printing a first conductive layer on a surface of the substrate, the first conductive layer includes a plurality of electrode units arranged in an M*N array, each of the electrode units includes a first electrode, and a plurality of second electrodes distributed around the first electrode; printing a first insulating layer on a side of the first conductive layer away from the substrate; printing a second conductive layer on a side of the first insulating layer away from the substrate; printing an anti-oxidation layer to cover surfaces of the first conductive layer and the second conductive layer away from the substrate; and printing a second insulating layer to cover regions of the substrate not covered by the first electrode and the second electrode. A circuit board is also provided.

Provided are a substrate with a functional fine line having excellent optical properties and excellent adhesion of the functional fine line, and a method for forming the functional fine line. The substrate with a functional fine line according to the present invention has an undercoat layer including a hydrophobically modified polyester resin on the substrate, and has a functional fine line including a deposit of functional microparticles and having a line width of 1 μm or more and 10 μm or less on the undercoat layer. The method for forming a functional fine line according to the present invention includes forming an undercoat layer including a hydrophobically modified polyester resin on a substrate, and then forming a functional fine line including a deposit of functional microparticles and having a line width of 1 μm or more and 10 μm or less on the undercoat layer.

A conductive slurry for plating comprises a carbon material, a dispersant, a binder, and a solvent. The carbon material, the dispersant and the binder are uniformly mixed in the solvent. The weight percentage of the carbon material is between 0.1% and 1%. The carbon material comprises a carbon nanotube, graphene, or a combination thereof. A plating method for a circuit board, which utilizes the conductive slurry, is also disclosed. The circuit board comprises at least a through hole. The plating method comprises a coating step, a first cleaning step, a first drying step, a first micro-etching step, a second cleaning step, an anti-oxidation step, a third cleaning step, a plating step, and a second drying step.

An occupant or object sensing system in a vehicle includes electrical circuits for capacitive sensing and corresponding circuits shielding the sensing system from interference. A sensing circuit and a shielding circuit may be printed by screen printing with conductive ink on opposite sides of a non-conductive substrate. The substrate is a plastic film or other fabric that has an elastic memory structure that is resilient to stretching. The conductive inks used to print circuits onto the substrate have a similar resilience to stretching such that the substrate and the circuits thereon can be subject to deforming forces without breaking the printed circuits. The substrate may be covered with a carbon polymer layer to provide alternative conductive paths that enable fast recovery for conduction in the presence of any break in the printed conductive traces on the substrate.

A pattern forming method capable of easily removing a discontinuous portion in a pattern while keeping resistance of the pattern low. A pattern forming method including at least a printing step of printing a pattern intermediate containing a conductive material on a base material 1, and a plating step of subjecting the pattern intermediate to an electroplating treatment, in which the pattern intermediate printed in the printing step has a plating target portion that is energized in the plating step and a discontinuous portion that is discontinuously formed from the plating target portion and is not energized in the plating step, and in the plating step, by performing an electric field plating treatment using a plating solution containing at least two or more types of metal salts containing different types of metals and a complexing agent, the discontinuous portion of the pattern intermediate is removed to form a pattern constituted by the plating target portion covered with a plating film.

Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

Attaching electronic components to a substrate utilizes conductive materials to attach the components and to form traces to allow electrical connectivity between pads receiving the components. Conductive inks are non-solderable and cannot be utilized as solder pads whereas solderable inks are non-conductive. By applying a substrate with conductive ink and then selectively applying a solderable ink on the conductive ink, electronic components may be attached to a substrate that provides mechanical attachment and electrical connectivity which may also be formable or flexible.

The present invention aims to provide a method of producing a pattern-transferred product with simple steps, the method being capable of producing a pattern-transferred product having good adhesion between a transferred pattern and the transfer-receiving body. The method of producing a pattern-transferred product of the present invention includes a step of forming a transfer pattern on a dissociation layer of a transfer sheet including at least a porous layer on a support and the dissociation layer on the porous layer; a transferring step, the step being selected from a step of transferring the transfer pattern to a transfer-receiving body having an adhesive surface or a step of transferring the transfer pattern to a transfer-receiving body via an adhesive material; and a step of removing adhesion from the surface of the transfer-receiving body or from the adhesive material.