A micro power distribution box is provided which includes a device, a connector/housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate is overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an aperture provided through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger in order to electrically connect the at least one electrical component to the at least one first finger. The connector/housing is configured to house the device therein and is configured to be connected to a mating connector. The cover is configured to be secured to the connector/housing in a manner which prevents the device from being removed from the connector/housing.

Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.

[Problem] Provided is a composite member which can contribute to simple formation and/or increased quality of fine wiring. [Solution] A composite member 100 according to one embodiment of the present invention includes a base material, an aliphatic polycarbonate-containing layer with multiple island-shaped portions arranged on the base material, and a metal ink, wherein at least a surface of the aliphatic polycarbonate-containing layer with multiple island-shaped portions has a contact angle of 50 or more between pure water and the surface when exposed to ultraviolet light including a wavelength of 180 nm or more and 370 nm or less for 15 minutes, and the metal ink is arranged on the base material at at least a portion of a region sandwiched by the precursor layers.

A flexible printed circuit and a method for manufacturing the same are revealed. Modified functionalized graphene is used to prepare a functionalized graphene-based ink. Then the functionalized graphene-based ink is printed on a surface of a flexible plastic substrate to form a conductive trace pattern of a circuit. A layer of deposited copper is formed on a surface of the functionalized graphene-based ink by chemical copper plating. Since the functionalized graphene-based ink is used as catalyst for electroless copper plating, no hexavalent chromium (chromium (VI)) and palladium are required. Thus the present method has the advantages of environmental protection and low cost. The conductive trace pattern formed by the functionalized graphene-based ink has excellent adhesive capacity and higher flexibility so that it can be securely attached to the surface of the flexible plastic substrate and used as an adhesive between the copper deposition and the flexible plastic substrate.

The present invention relates to a lighting system that enhances installation conditions, avoiding risks therein and during operation of the system over time, and which facilitates insertion of the electrical contacts of the functional unit and allows its concealment without modifying the conductive properties thereof.

A circuit board structure includes a multi-layer board, a conductive body, and an electroplated layer. The multi-layer board has a predetermined conductive layer embedded therein, and includes a first blind hole recessed in a board surface thereof so as to allow a part of the predetermined conductive layer to be exposed therefrom. The first blind hole has an aperture having a diameter within a range of 0.15-0.5 mm, and has an aspect ratio defined as M that is within a range of 1.5-10. The conductive body is filled in the first blind hole and is electrically coupled to the part of the predetermined conductive layer. An inner surface of the conductive body defines a second blind hole having an aspect ratio that is larger than 0 and is less than M. The electroplated layer is formed in the second blind hole and is connected to the inner surface.

A printed circuit board (PCB) stack having a plurality of layers is received. A conformal coating layer is applied to one or more external layers of the plurality of layers. A conductive ink is applied to one or more portions of the protective conformal coating layer to form one or more conductive features on the protective conformal coating layer.

A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive material to form first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A plating resist is applied. A conductive material is electro-plated to the first conductive structure to substantially fill the first recesses, and the plating resist is removed.

Discussed is a method of manufacturing a solar cell including preparing a single crystalline silicon substrate having a first conductive type impurity; forming a non-single crystalline silicon emitter layer having a second conductive type impurity opposite to the first conductive type impurity on a first surface of the single crystalline silicon substrate; forming a first transparent conductive oxide layer on the first surface of the single crystalline silicon substrate; forming a first electrode electrically connected to the first transparent conductive oxide layer; and forming a second electrode electrically connected to the single crystalline silicon substrate, wherein the forming of the first electrode includes; forming a first seed layer on the first transparent conductive oxide layer, and forming a first plating layer over the first seed layer by plating a first conductive material.

A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film, and a lightness L* of a conductive pattern non-formed region of the base film is 60 or less. The base film may include a modified layer on one surface side thereof.