The present invention relates to a resin composition for inkjet printing used to form a resin layer serving as an insulation layer of a printed wiring board by an inkjet printing method.

The present invention provides a photosensitive resin composition from which a dry resist film having excellent resilience, storage stability and heat resistance can be produced. The photosensitive resin composition according to the present invention includes a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group, a photopolymerization initiator and a thermal curing agent, wherein the thermal curing agent is a polycarbodiimide compound having a carbodiimide group, the carbodiimide group in the polycarbodiimide compound is protected by an amino group that can be dissociated at a temperature equal to or higher than 80° C. and the polycarbodiimide compound has a weight average molecular weight of 400 to 5000 and a carbodiimide equivalent of 180 to 2500.

Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film.

The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.

A photosensitive resin composition contains a compound A which has a heterocyclic structure having at least one atom of an oxygen atom, a nitrogen atom, or a sulfur atom in a ring structure, and has at least one functional group selected from the group consisting of —SH, —OH, —COOH, —NH.sub.2, and —CONH.sub.2, an alkali-soluble binder polymer, an ethylenically unsaturated compound, and a photopolymerization initiator.

Provided are a printed circuit board, a display device and a method of manufacturing a display device. The printed circuit board includes a base film including a first surface and a second surface, lead lines disposed on the first surface of the base film, and a first cover layer that covers at least a part of the lead lines and includes fill-in portions disposed between the lead lines. Each of the fill-in portions has a surface height less than a surface height of each of the lead lines with respect to the first surface of the base film.

A wired circuit board includes a base insulating layer, and a circuit disposed on a one-side surface in the thickness direction of the base insulating layer. The circuit includes a transmitting and receiving circuit and a component mounting circuit. The transmitting and receiving circuit includes a first wire. The first wire includes a first aspect ratio R1. The component mounting circuit includes a second wire electrically connected to the first wire. The second wire has a second aspect ratio R2 lower than the first aspect ratio R1.

A transparent conductive film is disclosed. The transparent conductive film includes a substrate; a first silver nanowire layer disposed on the substrate; and a protective layer disposed on the first silver nanowire layer, wherein the protective layer is a patternable photoresist and has an identical pattern as the first silver nanowire layer.

The present disclosure provides a photosensitive dry film enabling a photocured film being excellent in insulation reliability and resolution and having a frosted appearance to be obtained. A photosensitive dry film including a support film having a first main surface and a second main surface opposite to the first main surface, and a photosensitive resin layer provided on the first main surface, in which the first main surface has an irregular surface formed by chemical etching.

The present application relates to overmoulded printed electronic parts as well as to methods for preparing overmoulded printed electronic parts using conductive trace inks such as molecular inks, thermoset resins, and reinforcing materials such as glass microspheres and glass fabric.

The present invention provides a resin composition for resists that is for obtaining a resist which has the characteristics conventionally required of a resist and which also does not generate warping. This resin composition for resists includes a (meth)acrylic photocurable polymer, a thermosetting agent, and a photopolymerization initiator. The (meth)acrylic photocurable polymer includes a carboxyl group, an open-chain aliphatic hydrocarbon group having 12 or more carbon atoms, and an unsaturated double bond, and the glass transition temperature (Tg) of the (meth)acrylic photocurable polymer is 20° C. or less.