An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

An electronic device includes a flexible circuit structure. The flexible circuit structure includes a flexible substrate and an insulator. The flexible substrate has a surface on which a plurality of pads are disposed. The insulator is disposed on the flexible substrate and is disposed between two adjacent pads of the plurality of pads.

Various embodiments include sensor shift flexure arrangements for improved signal routing. For example, a camera with sensor shift actuation may include a flexure for suspending an image sensor from a stationary structure of the camera, and for allowing motion of the image sensor enabled by one or more actuators of the camera. The flexure may be configured to convey electrical signals between the image sensor and a flex circuit in some embodiments. According to some embodiments, the flexure may include a stack of layers comprising an electrical grounding portion that has an additional conductive layer adjacent to a base layer, which may reduce the overall resistivity of a ground current return path. In some embodiments, the flexure may additionally or alternatively include an impedance adjusting feature configured to adjust the impedance of an electrical signal pad used to connect the flexure with another component of the camera.

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

An electronic device is provided. The electronic device includes a display panel, a first connection member on which a display driver integrated circuit (DDIC) configured to control the display panel is disposed, a first contact point part disposed on the first connection member, a second contact point part spaced apart from the first contact point part in a second direction perpendicular to the first direction and disposed on the first contact point part, a second connection member disposed adjacent to the first connection member, a third contact point part arranged in the first direction and is disposed on the first layer of the second connection member to be connected to the first contact point part, and a fourth contact point part arranged in the first direction and is arranged on the second layer of the second connection member to be connected to the second contact point part.

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

The present disclosure relates to an anisotropic conductive film capable of electrode bonding even at a low temperature and maintaining excellent conductivity and flexibility, a manufacturing method thereof, and a display device using the same. The anisotropic conductive film contains conductive microcapsules including a liquid metal in a binder layer.

The present application discloses a display panel and a display device. The display panel includes a display area and a non-display area; the non-display area includes a bonding area away from the display area, and a plurality of terminals are disposed in the bonding area; and the non-display area further includes an anti-overflow portion disposed around the plurality of terminals. The present application prevents the problem of ACF overflow by disposing the anti-overflow portion around the plurality of terminals in the non-display area, such that the peeling of the glass substrate is facilitated, and the yield of the product is improved.

The disclosure provides a display panel and a displaying device. The display panel comprises a bonding area and an active area; a flexible printed circuit board, the flexible printed circuit board being arranged on a side, away from the active area, of the bonding area, and comprising a display signal line which extends in a first direction and is electrically connected to the bonding area; and a touch driving line and a signal receiving line, the touch driving line and the signal receiving line being connected to the flexible printed circuit board from the active area via the bonding area, and the display signal line not overlapping with the touch driving line or the signal receiving line.

A flexible circuit structure includes: a flexible substrate having a surface; a plurality of first pads disposed on the surface; and an insulating layer disposed on the surface and between two adjacent first pads of the plurality of first pads, wherein the insulating layer has a first maximum height in a normal direction of the surface, one of the plurality of first pads has a second maximum height in the normal direction of the surface, and the first maximum height is less than or equal to the second maximum height.