A component carrier is illustrated and described. The component carrier has i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ii) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier.

A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.

A resilient electrical connector assembly includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips and at least two conductive contacts. One contact is integrated with a conductive path on the base PCB and another contact pad is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

An electronic device embedded substrate and a method of manufacturing the same includes a substrate comprising a cavity formed therein, and an electronic device embedded in the cavity. The substrate and method thereof also include a first support pattern part formed on one surface of the substrate and pressing the electronic device to restrict a movement of the electronic device within the cavity, and a second support pattern part formed on another surface of the core substrate facing opposite to the one surface and extended toward an inside of the cavity to support the electronic device.

A system for wirelessly obtaining physiological data from a subject includes a sensor patch and a separate electronics package. The sensor patch is disposed on and adheres to the subject, and includes a first part of a releasable electrical connector. An electronics package includes a second part of the first releasable electrical connector, which is used to physically and electrically connect the electronics package to the sensor patch. The electronics package includes a flexible substrate, with shells set on this substrate. The shells enclose the electronics. The shells are connected by a flexible circuit board. Analog front end circuitry is placed in one shell, while the wireless transceiver is placed in the other shell.

Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.

This wiring board includes a substrate having a first elastic modulus and including a first surface and a second surface positioned on the opposite side of the first surface; wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board; and a reinforcing member having a second elastic modulus greater than the first elastic modulus and at least including a first reinforcing part that is positioned on the first surface side of the substrate or on the second surface side of the substrate and that at least partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate.

A plug connector provides an electrical connection to a conductor track connection of a printed circuit board. The plug connector has a first printed circuit board with a conductor track connection and a plugging region for plugging the printed circuit board into the plug connector. The plugging region extends parallel to the first printed circuit board. A contact element and/or a spring element is provided in the plug connector. The plugging region and the contact element and/or the spring element are arranged in such a way that, in a plugged state of the plug connector, the printed circuit board which is plugged into the plugging region is arranged parallel to the printed circuit board and the conductor track connection is arranged opposite the conductor track connection. An electrical connection of the conductor track connection to the conductor track connection is provided by the contact element and/or the spring element.

An arrangement is illustrated and described. The arrangement includes a component carrier including ia) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ib) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier; ii) the further component carrier connected with the component carrier by the at least one elastic element, wherein the further component carrier includes: iia) a further recess configured such that the component carrier is at least partially placeable into the further recess; iii) the component carrier is a smaller unit than the further component carrier, and iv) the component carrier is at least partially placed into the further recess.

A system for wirelessly obtaining physiological data from a subject includes a sensor patch and a separate electronics package. The sensor patch is disposed on and adheres to the subject, and includes a first part of a releasable electrical connector. An electronics package includes a second part of the first releasable electrical connector, which is used to physically and electrically connect the electronics package to the sensor patch. The electronics package includes a flexible substrate, with shells set on this substrate. The shells enclose the electronics. The shells are connected by a flexible circuit board. Analog front end circuitry is placed in one shell, while the wireless transceiver is placed in the other shell.