One aspect of the invention provides an interconnect between a stretchable electronic element and a circuit on a rigid or flexible printed circuit board (PCB Circuit), the stretchable electronic element is operable to be mechanically coupled to a substrate which deforms, and the stretchable electronic element will deform with the substrate and may or may not change an electrical characteristic as a result, the stretchable electronic element comprising one or more electrical pathways; the PCB Circuit configured to communicate electronically with the stretchable electronic element and comprising at least one circuit board extending from the stretchable electronic element to an electrical circuit on the PCB Circuit; wherein the interconnect comprises an electrical coupling between the electrical pathways of the stretchable electronic element and the PCB Circuit; and wherein the interconnect simultaneously prevents the connection between the stretchable electronic element from failing when the stretchable substrate is stretched in normal operation, minimizes the bulk of support material required to support the interconnect, and minimizes any reduction in the stretch capabilities of the stretchable substrate.

The present application provides a foldable array substrate, a preparation method thereof and a display device. The foldable array substrate includes a base substrate, a gate metal layer disposed on one side of the base substrate, a source-drain metal layer disposed on the side of the gate metal layer opposite to the base substrate, and an insulating layer disposed between the gate metal layer and the source-drain metal layer. A plurality of holes are disposed on the foldable array substrate, and the holes are disposed between adjacent pixel units of a plurality of pixel units, and extend from the side of the insulating layer opposite to the base substrate toward the base substrate.

A battery pack includes: a battery cell including first and second surfaces arranged at opposite sides and at which first and second electrodes are respectively located, and a side surface connecting the first and second surfaces to each other; a first circuit board arranged on the first surface and connected to the first electrode; a second circuit board arranged on the second surface; a first flexible line extending from a first side of the first circuit board to the second circuit board while surrounding a portion of the side surface of the battery cell; and a second flexible line extending from a second side of the first circuit board to the second surface of the battery cell while surrounding another portion of the side surface of the battery cell and connected to the second electrode.

A battery pack includes: a battery cell including a first surface and a second surface which are opposite each other and on which first and second electrodes are respectively formed, and a lateral surface connecting the first and second surfaces to each other; a first circuit board arranged on the first surface and connected to the first electrode; a second circuit board arranged on the second surface and connected to the second electrode; and a flexible wiring crossing the lateral surface of the battery cell and electrically connecting the first and second circuit boards to each other, and the first circuit board includes: a first compressible conductor on an inner surface of the first circuit board, the inner surface facing the first electrode; and a first pressing surface and a first mounting portion on an outer surface of the first circuit board.

Provided are terminal-free connectors for flexible interconnect circuits. A connector comprises a housing chamber defined by at least a first side wall and a second side wall oppositely positioned about the base. An edge support is positioned at each of the first side wall and the second side wall. The edge supports allow for precise placement of the flexible interconnect circuit inside the housing chamber. A cover piece is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. The cover piece includes a clamp portion securing the flexible interconnect circuit against the edge supports in the clamped position. A slider may be configured to move between an extended position and an inserted position within the housing chamber, and may include a convex upper surface configured to urge the flexible interconnect circuit upwards in the inserted position.

In a flexible OLED device production method, after an intermediate region and flexible substrate region of a plastic film of a multilayer stack are divided, the interface between the flexible substrate region and glass base is irradiated with laser light. The multilayer stack is separated into first and second portions while the multilayer stack is kept in contact with the stage. The first portion includes a plurality of OLED devices in contact with the stage. The OLED devices include a plurality of functional layer regions and the flexible substrate region. The second portion includes the glass base and intermediate region. The laser light is formed from a plurality of arranged laser light sources and irradiation intensity for at least part of the interface between the intermediate region and the glass base is lower than the irradiation intensity for the interface between the flexible substrate region and the glass base.

A flexible membrane adapted to carry high-frequency power signals is described having a plurality of contact pads in a central portion of the flexible membrane connected to a plurality of micro contact probes and a plurality of contact structures connected to a support plate in a peripheral portion of the flexible membrane, as well as a plurality of conductive tracks connecting the contact pads with the contact structures. The flexible membrane further includes an intermediate portion between the central and peripheral portions. The elastic membrane is divided into a first area having a first total thickness and into a second area having a second total thickness. The first area is contiguous and adjacent to the second area. The first total thickness is less than or equal to 75 m and the second total thickness is greater than the first total thickness.

A printed circuit board-and-plug arrangement comprises a printed circuit board from which at least one electrically conductive contact lug which is electrically connected to at least one conductor track of the printed circuit board protrudes, and a plug housing composed of insulating material, which plug housing has at least one opening, wherein a metal strip or metal wire is embedded in the insulating material so that at least a portion of the metal strip or the metal wire protrudes into the opening, wherein the plug housing is releasably connected to the printed circuit board so that the contact lug is inserted into the opening and thereby comes into contact with the portion, wherein the longitudinal direction of the contact lug and the longitudinal direction of the portion run perpendicularly in relation to one another.

Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.

A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.