To prevent both increase in impedance and a short circuit, a connector cable is configured such that a connector and a shielded cable are connected via a relay substrate. The shielded cable includes at least an inner conductor, a dielectric covering the inner conductor, and a shield member covering the dielectric. The inner conductor is connected to a contact of the connector at a part where the shield member and the dielectric are removed to expose the inner conductor. At least directly under a part where the shield member is removed to expose the dielectric, a ground (GND) conductor layer on a front surface of the relay substrate is arranged. The GND conductor layer on the front surface of the relay substrate, which is arranged directly under the part where the shield member is removed, is covered with an insulating member.

In examples, a method of manufacturing a semiconductor package comprises providing an array of unsingulated semiconductor packages, the array having a bottom surface and a conductive terminal exposed to the bottom surface, the conductive terminal including a slot configured to receive solder material. The method includes coupling a tape to the array of unsingulated semiconductor packages and applying a first saw blade to the bottom surface of the array to partially saw through a thickness of the array to a depth between two individual, adjacent, unsingulated semiconductor packages in the array of unsingulated semiconductor packages, the first saw blade producing a kerf. The method includes applying a second saw blade into the kerf to fully saw through the thickness of the array and produce a singulated semiconductor package, a width of the second saw blade narrower than the first saw blade. The conductive terminal is exposed to a side surface of the singulated semiconductor package, the side surface including a recessed area having a horizontal depth of no more than 30 microns.

An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.

A surface mount transmission line capacitor can have excellent high frequency performance characteristics. The surface mount transmission line capacitor can include a monolithic substrate having a surface, a first electrode formed over the surface, a second electrode arranged over the first electrode, a dielectric layer arranged between the first electrode and second electrode, a first terminal layer exposed along the surface of the substrate and electrically connected with the first electrode, and a second terminal layer exposed along the surface of the substrate and electrically connected with the second electrode. The first terminal layer and the second terminal layer can be contained within a perimeter of the surface of the monolithic substrate.

A soldering aid for securing a stranded core of a cable on an electrical contact surface of a printed circuit board includes an outer part having a receptacle and a bearing surface, and an inner part that is displaceably received inside the receptacle of the outer part. The inner part has an access opening through which the contact surface is accessible and can be fastened to the outer part in an assembly position. In an inserted position of the inner part in the outer part, an insertion opening in the inner part is aligned with an insertion opening in the outer part for inserting the stranded core of the cable.

A wiring module is configured to attach to a power storage element group of an arranged plurality of power storage elements, each one of the power storage elements including an electrode terminal, including a bus bar that connects to the electrode terminal; a circuit board on which a conductive path is formed; and a relay member that connects the bus bar and the circuit board, wherein the relay member includes a bus bar connection portion that connects to the bus bar and a board connection portion that connects to the conductive path of the circuit board, the relay member includes a connection portion with a plate-like shape that joins the bus bar connection portion and the board connection portion and extends in a direction intersecting an arrangement direction of the plurality of power storage elements, and the connection portion includes a first deformation portion capable of deforming in the arrangement direction.

A connection assembly for an antenna includes a printed circuit board and a coaxial cable connected to the printed circuit board. A transmission trace and a solder pad are provided on the printed circuit board. An opening for receiving an end portion of the coaxial cable is also provided in the printed circuit board, and an exposed outer conductor of the end portion extends into the opening, and an exposed inner conductor reaches the solder pad. The connection assembly further includes a ground structure, which is electrically connected to a ground metal layer on a second surface of the printed circuit board, and the ground structure is at least partially arranged on both sides of the exposed inner conductor and/or the exposed outer conductor.

A camera module is provided with: an imaging element which is formed in a rectangular shape and has a plurality of pads provided to a back surface opposite from an imaging surface; a substrate where, on the same plane, a plurality of linear conductors are lined up in parallel and have an insulating coating in a rectangular shape such that the side of one end and the other end in the direction of extension of the conductors is shorter than one side of the imaging element, the conductors at the one end and the other end being exposed at a plate surface front and/or back; and a low-melting-point electroconductive material for connecting, to each of the pads, the conductors of the one end that are exposed due to one end surface of the substrate being abutted against the back surface.

A strain relief plug to restrict movement of wires on a printed circuit board, the strain relief plug having an elongated stem along a vertical axis of the strain relief plug. The strain relief plug has an in-board flange defined by the elongated stem, the in-board flange configured to seat in a bore defined by the printed circuit board. The strain relief plug has an anchor defined by a first end of the elongated stem configured to prevent the strain relief plug from releasing from the printed circuit board. The strain relief plug has a bar defined by a second end of the elongated stem and transverse the vertical axis, the bar forming wire channels. The strain relief plug provides strain relief for wires on the printed circuit board of an electric motor in a vertical dimension resembling the thickness of the printed circuit board.

3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.