A display device includes a first substrate, a second substrate disposed on the first substrate, an image display layer disposed between the first substrate and the second substrate, a gate driver disposed at a first side surface of the first substrate, a data driver disposed at a second side surface of the first substrate, and conductive layers respectively disposed in recesses recessed from the first side surface of the first substrate. The gate driver is electrically connected to the conductive layers.

A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.

A flat electrical cable extends longitudinally along a length of the cable. The flat electrical cable includes a plurality of conductor sets extending along the length of the cable. Each conductor set includes one or more insulated electrical conductors. Each insulated conductor includes a central conductor surrounded by a first dielectric material. The plurality of conductor sets includes a middle conductor set disposed between two other conductor sets and an edge conductor set disposed proximal to a longitudinal edge of the cable. The first dielectric material of each insulated conductor of the edge, but not the middle, conductor set includes an intumescent flame retardant material.

A power supply apparatus includes a board including a major surface on which a circuit element is mounted, and a case. The case includes a cover portion located at a distance from the board and covering the major surface of the board, and a plurality of leg portions extending from the cover portion toward the board, the case being attached to the board by the leg portions. The leg portions of the case include corner-attachable leg portions that are engaged with corner portions of the board.

Disclosed is a packaging solution, such as a lead frame for circuit board packaging, a packaged integrated circuit board, a power chip, and a circuit board packaging method. The lead frame includes a plurality of frame units disposed in parallel in a first direction. The frame unit includes a hollow bezel, and a plurality of pins and connecting ribs that are disposed in the bezel. Each pin includes a first pin part and a second pin part that extend in a second direction and are integrally formed. The first pin part is disposed in the bezel, the first pin part is configured to electrically connect to a circuit board, and the second pin part is connected and fastened to the bezel. The second direction is perpendicular to the first direction. The connecting ribs are connected among the plurality of pins and the bezel.

A dielectric substrate has a first surface including a first terminal joint and a second terminal joint arranged along a first side surface. A first lead terminal is bonded to the first terminal joint with a bond. A second lead terminal is bonded to the second terminal joint with a bond. The first lead terminal includes a first base bonded to the first terminal joint and a first lead extending from the first base. The second lead terminal includes a second base bonded to the second terminal joint and a second lead extending from the second base. The first lead terminal includes the first base having a larger thickness than the first lead.

An electrical device that comprises a printed circuit board, which has a first mounting surface, a second mounting surface, a mounting edge, and a plurality of mounting pads on the first mounting surface and the second mounting surface, and an electrical component that has a ball grid array. The electrical device further comprises an adaptor, interposed between the mounting edge and the electrical component, and comprising a body, made of an electrically non-conductive material, and a plurality of electrical pins, made of an electrically conductive material and passing at least partially through the body of the adaptor. The first end of each one of the plurality of electrical pins is electrically directly mounted to a corresponding one of the spaced apart solder balls. The second end of each one of the plurality of electrical pins is electrically directly mounted to a corresponding one of the plurality of mounting pads.

The present invention relates to a touch sensor module and an image display device including the same. The touch sensor module includes a touch sensor including pad portions, a flexible printed circuit board (FPCB) including terminal portions, and a solder joint interposed between the touch sensor and the flexible printed circuit board, in which the solder joint includes a solder paste including solder balls and a flux, the pad portions and the terminal portions are electrically connected through the solder balls compressed by heating and pressing, the flux is used in an amount of 5 to 40 wt % based on the total weight of the solder paste, and the ratio of the diameter of the solder balls included in the solder paste to the gap between the pad portions of the touch sensor and the terminal portions of the flexible printed circuit board is 1:0.2-0.6.

A optical module according to the present invention includes an optical semiconductor device, a package housing the optical semiconductor device, a first pattern provided on an upper surface of the package, a second pattern provided on a side surface continuous with the upper surface of the package, a flexible substrate provided on the first pattern and extending from the upper surface to a side surface side of the package and solder joining the first pattern and the flexible substrate together, wherein the solder is spread between a portion of the flexible substrate, the portion extending from the upper surface to the side surface side of the package, and the second pattern.

Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Terminals may be inserted into the terminal holes and connected to conductive features or plating within the holes. A conductive element may be provided on the substrate to connect to a terminal. Alternatively solder may be dispensed into the holes for surface mounting.