A cable connection structure includes: a substrate that includes: an opening; and a core wire connection electrode that is arranged on one of a principle surface and an inner layer across the opening; a cable that is arranged on a principle surface side of the substrate and includes a core wire that is electrically connected to the core wire connection electrode, the core wire connection electrode being extended so as to be separated from the substrate, the core wire connection electrode being connected to the core wire.

A coaxial connector includes a base surface; a coaxial structure where a dielectric is between a central conductor and an outer conductor; and a protrusion protruding from the base surface. The central conductor includes a contact portion protruding from the base surface. In response to a substrate being inserted toward the base surface between the contact portion and the protrusion, the contact portion comes into contact with a conductor pattern formed on a surface of the substrate. The outer conductor includes a protruding conductor protruding from the base surface and not in contact with the substrate inserted between the contact portion and the protrusion.

A power supply apparatus includes a board including a major surface on which a circuit element is mounted, and a case. The case includes a cover portion located at a distance from the board and covering the major surface of the board, and a plurality of leg portions extending from the cover portion toward the board, the case being attached to the board by the leg portions. The leg portions of the case include corner-attachable leg portions that are engaged with corner portions of the board.

A circuit board for use in a modular electrical connector. The circuit board has a first surface and an oppositely facing second surface. Signal pathways are provided on the first surface. The signal pathways have signal pathway ends abutting a mounting end of the circuit board. First ground pathways are provided on the first surface. The first ground pathways are positioned adjacent at least one of the signal pathways. The first ground pathways have first ground pathway ends abutting the mounting end of the circuit board. One or more second ground pathways are provided on the second surface. The one or more second ground pathways have second ground pathway ends abutting the mounting end of the circuit board. The positioning of the signal pathway ends, the first ground pathway ends and the second ground pathway ends abutting the mounting end reduces crosstalk between signal pairs.

An electronic device (1), is provided that comprises an electronic component (30) that is arranged on a component carrier (23) in a cavity (14) of a stack (10) of layers. One or more layers carry electrical conductors (15). The cavity (14) extends through the stack of layers from one of said layers (12n) to another one of said layers (12x). The component carrier (23) comprises electrically conductive tracks (24) from electric contacts (31) of the electronic component (30) to electric terminals (25) of the component carrier to a wall of the cavity to form an electrical connection with a respective one of said electrical conductors (15).

A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated opposite at least the terminal connecting area, wherein a thickness of the reinforcement member increases toward the one end edge in a stepwise or gradual manner.

The present invention relates to a touch sensor module and an image display device including the same. The touch sensor module includes a touch sensor including pad portions, a flexible printed circuit board (FPCB) including terminal portions, and a solder joint interposed between the touch sensor and the flexible printed circuit board, in which the solder joint includes a solder paste including solder balls and a flux, the pad portions and the terminal portions are electrically connected through the solder balls compressed by heating and pressing, the flux is used in an amount of 5 to 40 wt % based on the total weight of the solder paste, and the ratio of the diameter of the solder balls included in the solder paste to the gap between the pad portions of the touch sensor and the terminal portions of the flexible printed circuit board is 1:0.2-0.6.

A soldering fixture for coupling surface-mount leads of an edge connector to corresponding pads on a PCB includes a base for positioning over the edge connector. A threaded mounting shaft is connected to the base and rotatable relative thereto. An alignment shaft is threadably engaged with the threaded mounting shaft and connected to the base such that rotation of the threaded mounting shaft causes longitudinal movement of the alignment shaft relative to the threaded mounting shaft and the base. An adjustment device is connected to the threaded mounting shaft for rotating the threaded mounting shaft to move threads on the alignment shaft into engagement with the leads to move the leads into alignment with the pads.

A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body connected to a mounting surface of the circuit body using a solder. The conductive body has a pair of connection portions opposed to each other and extending along the mounting surface. The solder forms solder fillets located around the pair of the connection portions and extending along the mounting surface. A first fillet width of one solder fillet among the solder fillets located in an inside region between the pair of the connection portions is larger than a second fillet width of another one solder among the solder fillets located in an outside region on an opposite side to the inside region across the connection portions.

A stacked electronic structure comprises: a substrate and a magnetic device, wherein electronic devices and conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the electronic devices, and the magnetic device is disposed over and electrically connected to the conductive pillars, wherein at least one recess or groove can be formed on the bottom surface of the conductive pillar, such as copper pillar, to help the venting of the soldering material as well as to increase the soldering area.