A substrate includes electrically-conductive tracks. A semiconductor chip is arranged on the substrate and electrically coupled to selected ones of the electrically-conductive tracks. Containment structures are provided at selected locations on the electrically-conductive tracks, where the containment structures have respective perimeter walls defining respective cavities. Each cavity is configured to accommodate a base portion of a pin holder. These pin holders are soldered to the electrically-conductive tracks within the cavities defined by the containment structures. Each containment structure may be formed by a ring of resist material configured to receive solder and maintain the pin holders in a desired alignment position.

A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish.

The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

Adaptable lens assemblies, optoelectronic components, and associated methods of manufacturing are provided. An example optoelectronic component includes a printed circuit board (PCB) and an adaptable lens assembly. The adaptable lens assembly includes a lens packaging structure supporting an optical lens at a focal distance and a lens support structure. The lens support structure defines a first side configured to support the lens packaging structure and maintain the focal distance and a second side removably attached to the PCB. The attachment between the second side of the lens support structure and the PCB is configured to enable selective attachment and detachment of the lens support structure and lens packaging structure supported thereon without causing damage to the PCB.

In a high-frequency module provided with a shield member between components, improvement in the degree of freedom in design such as arrangement of components or the like is achieved while preventing damage to a wiring board. A high-frequency module (1a) includes a multilayer wiring board (2), a plurality of components (3a) and (3b) mounted on an upper surface (20a) of the multilayer wiring board (2), and a shield member (5) for shielding between the component (3a) and the component (3b), in which the shield member (5) is formed in a flat plate shape, with a plurality of metal pins (5a) each stacked in a thickness direction of the sealing resin layer (4) such that a length direction is made to be substantially parallel to the upper surface (20a) of the multilayer wiring board (2), and a resin molded portion (5b) for fixing the metal pins (5a).

Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

A universal pin production support device provides a resettable surface mount carrier that eliminates the need for single assembly tooling. The design of the UPPS allows for it to be custom set to fix and support each specific circuit board or assembly.

A memory module includes a printed circuit board (PCB) including a multi-layer having a wiring structure formed therein. A length of the PCB in a first direction is longer than a length of the PCB in a second direction perpendicular to the first direction. A plurality of memory chips includes a plurality of solder balls. The plurality of memory chips is arranged in a first row and a second row respectively extending in the first direction on the PCB. The plurality of solder balls is continuously arranged in the first direction. The wiring structure alternately zigzag-connects the plurality of memory chips arranged in the first row and the second row.

A device for driving a compressor of a vaporous fluid which exhibits a housing with a cooling surface and a power supply arrangement with at least one switching element, at least one PCB, as well as at least one spring element for applying a spring force on the at least one switching element. The switching element is connected to the PCB. The cooling surface and the PCB are arranged relative to one another in a direction z with spacing. The at least one switching element is arranged such that it is in contact with the housing with a first surface in the area of the cooling surface and that the at least one spring element for pressing the switching element against the cooling surface is in contact with a second surface of the switching element.