A control that can be a throttle control of a handle-bared vehicle is presented. According to some embodiments, a control can include a plurality of circuit boards, each of the circuit boards including a transmission coil, sensor coils, and control circuitry the drives the transmission coil and receives signals from the sensor coils; and one or more targets mounted on a shaft and configured to rotate over the sensor coils of the plurality of circuit boards as the shaft is rotated, wherein the plurality of circuit boards are mounted around the shaft, and wherein the position of the target is determined by the control circuitry as the shaft is rotated.

A control that can be a throttle control of a handle-bared vehicle is presented. According to some embodiments, a control can include a plurality of circuit boards, each of the circuit boards including a transmission coil, sensor coils, and control circuitry the drives the transmission coil and receives signals from the sensor coils; and one or more targets mounted on a shaft and configured to rotate over the sensor coils of the plurality of circuit boards as the shaft is rotated, wherein the plurality of circuit boards are mounted around the shaft, and wherein the position of the target is determined by the control circuitry as the shaft is rotated.

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.

An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard.

An electrical connector for electrically conducting a chip module to a circuit board. At least one pad is disposed on the circuit board. The electrical connector includes an insulating body for sustaining the chip module, multiple signal terminals disposed in the insulating body and electrically conducting the chip module, and a first shielding sheet and a second shielding sheet respectively located on two adjacent sides of the signal terminals. The first shielding sheet and the second shielding sheet are connected to the same pad.

A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.

A method for interconnecting two conductors includes creating a first nickel layer on a first conductor of an electrical component, producing a first non-gold protective layer on the first nickel layer, the first non-gold protective layer being configured to prevent the first nickel layer from oxidizing, creating a second nickel layer on a second conductor, producing a second non-gold protective layer on the second nickel layer, the second non-gold protective layer being configured to prevent the second nickel layer from oxidizing, and interconnecting the first and second nickel layers using a solder layer that interfaces with the first and second nickel layers between the first and second conductors.

A circuit board assembly includes a connection circuit board, a near field communication antenna and solders. The connection circuit board includes circuit board pads. The near field communication antenna is attached to the connection circuit board, and the near field communication antenna includes: an antenna coil, antenna pads electrically connected to the antenna coil, and through holes penetrating the antenna pads and disposed opposite to the circuit board pads. The solders are connected to the circuit board pads through the through holes.

The disclosure relates to an electronic component that includes a printed circuit board with two opposite flat sides and a plurality of electronic components, and a base plate. A number of the electronic components are each fixed on and electrically conductively connected to a rear flat side of the printed circuit board and a further number of the electronic components are each fixed on and electrically conductively connected to a front flat side of the printed circuit board. The base plate has at least one first cutout for receiving electronic components that are arranged on the rear flat side of the printed circuit board. The disclosure also relates to a method for producing an electronic component of this kind.

A method of joining electronic components to an electronic substrate in an apparatus includes: (1) transporting electronic substrates through a chamber housing including a tunnel extending through multiple processing zones; (2) detecting temperatures of the electronic substrates passing proximate to a heat detection system including at least one temperature sensor coupled to the chamber housing; (3) receiving temperature data from the heat detection system with a controller coupled to the multiple processing zones, the conveyor, and the heat detection system; (4) determining, by the controller, with reference to the detected temperatures of the electronic substrates, an adjustment to at least one of (a) a heat setting of a heating element within the chamber housing, (b) a speed of the conveyor, and (c) an operational speed of a blower within the chamber housing; and (5) performing the determined adjustment.