A connector, in particular an electrical connector. The connector includes a guide plate, which is configured to be electrically insulating, and a plurality of electrical contact wires, which are in particular stamped, in particular contact pins. The contact wire has an angular, in particular quadrilateral, cross section and is guided through an aperture in the guide plate and projects from the guide plate. In a direction extending through the thickness of the guide plate, the aperture includes a guide shaft. The guide shaft includes at least one planar wall, for guiding a flat side of the contact wire. The guide shaft also includes, on the opposite side to the planar wall, at least one wall region that extends obliquely to it and is configured to touch a corner of the contact wire.

An electronic device includes a first electronic component including a first main body, a second electronic component including a second main body, a mounting substrate having a mounting surface, and a heat dissipator having an attaching surface. The mounting surface and the attaching surface face each other in the z direction. The first main body and the second main body are disposed between the mounting substrate and the heat dissipator in the z direction and arranged side by side in the x direction. The first main body has a first front surface facing the attaching surface and a first back surface facing the mounting surface. The second main body has a second front surface facing the attaching surface and a second back surface facing the mounting surface. The dimension of the second main body in the z direction is smaller than the dimension of the first main body in the z direction. The first front surface and the second front surface overlap with each other as viewed in the x direction. A gap is provided between the second back surface and the mounting surface.

A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.

A backplane connector includes a housing and a number of wafers assembled to the housing. Each wafer includes a number of conductive terminals, an insulating frame and a metal shield. The housing includes an insulating housing and a metal shell fixed to the insulating housing. The insulating housing includes a number of slots for positioning the wafers. The metal shell is provided with a mating surface and a number of terminal receiving grooves. The contact portions of the conductive terminals are exposed in the corresponding terminal receiving grooves. The present disclosure improves the structural strength of the backplane connector and reduces the risk of damage the mating surface due to the push or collision of a mating connector.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A hot wind is blown to a land and a lead from the underside of a printed board, to perform preheating. At the start of preheating or after start of preheating, a laser beam is applied to a soldering point, and meanwhile, wire solder is fed to a position contacting with the soldering point. The fed wire solder is melted by the laser beam. After soldering is finished, feeding of the wire solder is stopped. Application of the laser beam is stopped, to solidify the melted solder.

An electronic device including a coin-cell battery is provided. The electronic device further includes a housing, a battery comprising a first surface, a second surface, and a third surface, a first electrode disposed in the first surface and a second electrode disposed in the second surface, a first electrode tap, a second electrode tap, and a printed circuit board connecting the first electrode tap to the second electrode tap of the battery on the third surface. Soldering parts are formed on a first surface of the printed circuit board to connect an end of the first electrode tap to a first contact portion of the printed circuit board and an end of the second electrode tap to a second contact portion of the printed circuit board, respectively. A solder flow control member is formed on a second surface of the printed circuit board.

An electric motor includes a rotor assembly, a stator assembly, a printed circuit board, and a solder cup. The stator assembly includes a lamination stack defining teeth, coils supported about the teeth, and a conductive terminal electrically connected to at least one coil. The conductive terminal includes a lead portion. The printed circuit board is coupled to the stator assembly and includes opposed first and second sides, and a through hole extending through the printed circuit board and receiving the lead portion. The printed circuit board further includes a solder pad surrounding the through hole on at least one of the first side or the second side. The solder cup is supported on the lead portion between the printed circuit board and the stator assembly, and includes a wide end facing toward the printed circuit board, and a narrow end opposite the wide end.

Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.