What is provided is an adapter plate for HF structures, which is set up for being disposed between a back of a circuit board and a reflector, wherein the adapter plate is electrically conductive, and the adapter plate has an opening or a cavity at every location where an element is passed through the circuit board to the side of the adapter plate, wherein at least one element is passed through the circuit board exclusively for ground contacting.

A board includes: a signal layer; a first layer and a second layer disposed so as to interpose the signal layer; a connector shell portion embedded on a first surface side of the board; a first solder joint portion that brings the connector shell portion and the first layer to be electrically conductive with each other; a contact portion disposed in a state where a center axis line of the contact portion coincides with a center axis line of the connector shell portion and the contact portion is electrically conductive with the signal layer; and an insulating portion disposed around the contact portion.

A stacked I/O connector with surface mountable tails and a printed circuit board (PCB) configured to receive the connector. The connector may avoid terminal deformations or scratches when the connector is mounted to the PCB. The PCB may include solder pads on a single surface or both surfaces. The sold pads may be configured for the tails of the connector to be attached with a surface mount soldering technique. As a result, the connector has high density and high speed, requires, requires a smaller mounting area on a PCB, relaxes the limitations in routing PCB traces, and reduces the electrical performance deterioration caused by PCB trace routing limitations. The connector may have row-oriented terminal subassemblies, holes in the connector housing and other features to facilitate reliable manufacture and operation of the connector.

A printed board includes: a depression formed in at least one surface of a board; an open hole formed in the board so as to penetrate the board from a bottom portion of the depression; and a conductor formed over an edge of an opening portion of the open hole and an inner surface of the open hole.

A holder is provided for holding an electrical component on a circuit board having a lead hole. The holder includes a body having a base for holding the electrical component and a connection member for mounting the body to the circuit board. The base includes a lead opening that is configured to hold a solder lead of the electrical component therein. The connection member extends from the base and is configured to mechanically connect to the circuit board such that the base holds an end of the solder lead of the electrical component within the lead hole of the circuit board.

An electronic module includes a circuit board having three first holes arranged therein in a predetermined pattern, and a cable having at least three wires, a support clip and a body. The three wires are arranged around a longitudinal axis of the cable. The support clip has a fixing element arranged radially outside the wires. The wires are held by the fixing element in such a way that the support clip is fixed in a non-rotational manner relative to the wires. The cable is configured in such a way that the support clip is connected in a non-rotational manner to the body with respect to the longitudinal axis, and that a course of the wires is deflected by the body in such a way that the ends of the wires are positioned in the predetermined pattern. Conductors of the wires are disposed in the first holes.

An electronic component unit and a wire harness include a bus bar plate. The bus bar plate is equipped with a resistor that has a main body and a pair of terminals protruding from the main body, and a substrate main body in which a metallic bus bar is built in a resin material and which has a component mounting section with the resistor mounted thereon. The component mounting section includes a pair of through-holes that penetrates the resin material and the bus bar and allows the terminals to pass, and a recess that is provided between the pair of through-holes, extends in a straight line shape connecting the pair of through-holes, and is capable of supporting the main body of the resistor.

To reduce the occurrence of capacitor mounting failure on a circuit board in the solder reflow process, the capacitor element is housed in the bottomed cylindrical outer case and sealed with a sealing member the open end of the outer case, the lead terminal derived from the capacitor element is formed through the sealing member a capacitor body, a base having a bottom surface portion and a side wall formed so as to surround the outer periphery of the capacitor body with a through hole through which the lead terminal penetrates, a capacitor having a convex portion protruding toward the capacitor body from the inner surface of the side wall, the caulking portion formed by caulking the side surface of the outer case the convex portion is disposed, providing a gap portion between the caulking portion and the convex portion.

A method for producing a connection contact for a sensor or an actuator of a vehicle, the method including: providing a printed circuit board having at least one electronic component arranged thereon and having an opening; inserting a contact bushing into the opening; and combined soldering the at least one component to the printed circuit board and the contact bushing to the printed circuit board in one task. Also described are a related circuit board and a vehicle control unit.

A flexible printed circuit includes disclosed in this specification is a flexible printed with a plurality of conductive paths to which connection protruding portions of connection protruding pieces protruding from conductive members to be connected to electrode terminals of power storage elements are to be connected. The flexible printed circuit includes a plurality of inlet openings that are larger in size than the external shapes of the connection protruding portions and into which the connection protruding portions can be inserted with a gap being formed around each protruding portion, and a plurality of entrance openings that are provided corresponding to the inlet openings, have a configuration in which the protruding portions can be moved thereinto from the inlet openings, and extend in the form narrower than the inlet openings. Each of the conductive paths includes a land that is located at an edge portion of the entrance opening and to which the connection protruding portion is to be connected.