A semiconductor apparatus includes a metal body in which a through hole is formed, a socket that covers the metal body without closing the through hole, a connection terminal connected to the metal body and exposed to an outside of the socket, a control board having a metal pattern and a circuit pattern, and a semiconductor chip having a control terminal connected to the circuit pattern via the through hole without being in contact with the metal body, the connection terminal being connected to the metal pattern.

A backplane connector includes a housing, a number of terminal modules assembled to the housing, and a mounting block. The housing includes a base, a first side wall and a second side wall. Each terminal module includes a first signal terminal and a second signal terminal. The first signal terminal has a first mounting foot, and the second signal terminal has a second mounting foot. The housing includes a receiving groove at a bottom end of the base. The mounting block is received in the receiving groove. The mounting block is made of electroplated plastic. The mounting block has an opening for the first mounting foot and the second mounting foot to extend through. As a result, the backplane connector has a better shielding effect.

An electronic device and a method of forming such an electronic device are disclosed. The electronic device can include an integrated device package and a component. The integrated device package includes a substrate and a package body over the substrate, and a hole formed through the package body to expose a conductive pad of the substrate. The component is mounted over the package body, and includes a component body and a lead extending from the component body through the hole. The lead includes an insulated portion and a distal exposed portion, and the insulated portion includes a conductor and an insulating layer disposed about the conductor, wherein the distal exposed portion is uncovered by the insulating layer such that the conductor is exposed at the distal portion. The electronic device can also include a conductive material that electrically connects the distal exposed portion to the conductive pad of the substrate.

An electrical assembly may include a contactor, a bus bar connected to the contactor, a bracket connected to the bus bar, a flexible circuit electrically connected to the contactor, and/or a cooling member connected to the bracket. A method of assembling an electrical assembly may include disposing a flexible circuit at least partially on and/or in the bracket, connecting a bus bar with the one or more contactors, connecting the bus bar with the bracket, electrically connecting the flexible circuit to the one or more contactors, disposing a cooling member on or about the bracket, and/or connecting the cooling member with the bracket.

An electrical component comprises a main body, a fulcrum portion and at least two terminals including a first terminal and a second terminal. Each of the terminals has a first portion and a second portion. The first portion of one of the first terminal and the second terminal is brought into contact with a circuit board when the main body is tilted relative to the circuit board with the fulcrum portion, which acts as a fulcrum, under an insertion state where the terminals are inserted into through-holes, respectively, while none of the terminals are soldered thereto. When the main body is tilted relative to the circuit board with the fulcrum portion, which acts as the fulcrum, under the insertion state, the second portion of one of the first terminal and the second terminal is brought into contact with the circuit board to regulate an excessive tilt of the main body.

A substrate structure, a manufacturing method thereof, and an electronic device. The substrate structure includes a substrate, conductive wires and conductive members. Multiple through holes penetrate through the substrate body of the substrate. Multiple first conductive pads are arranged on the first surface of the substrate body. Multiple second conductive pads are arranged on the second surface of the substrate body. The conductive wires are accommodated in the through holes and each has a first end in the first opening of corresponding through hole and a second end in the second opening of corresponding through hole. The conductive members are distributed on the first and second surfaces, and both ends thereof are connected to the corresponding first and second conductive pads through the conductive members. At least part of each conductive wire does not contact the hole wall of each through hole in a direct manner.

Provided is a photosensor in which a cable can be easily mounted on a circuit board. A photosensor [[1]] is provided with: a housing [[2]]; a cable [[5]]; a first circuit board [[3]]; and a second circuit board [[4]]. A through-hole [[24]] is formed in the housing [[2]]. The cable [[5]] is inserted into the through-hole [[24]]. The first circuit board [[3]] and the second circuit board [[4]] are accommodated in the housing [[2]]. The first circuit board [[3]] is provided with a first connector [[34]]. The second circuit board [[4]] has a first portion [[41]] and a second portion [[42]]. The cable [[5]] is soldered to the first portion [[41]]. The second portion [[42]] is provided with a second connector [[44]]. The second connector [[44]] is inserted into the first connector [[34]]. The second circuit board [[4]] connects the cable [[5]] and the first circuit board [[3]].

A terminal fixing method, for fixing one or more terminals to a plurality of lands provided on a substrate by laser welding, includes: constructing the plurality of lands by one or more terminal installation lands on which the terminals are installed and one or more dummy lands each larger than each of the terminal installation lands; irradiating each of divided laser beams emitted from a laser oscillator toward a corresponding land of two or more lands in the plurality of lands by the laser welding; and constructing the two or more lands by two or more terminal installation lands in the terminal installation lands, or one or more terminal installation lands in the terminal installation lands and the one or more dummy lands.

What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.

A method is provided for mounting a semiconductor IC to a substrate without a socket or solder. The method includes disposing a guide structure on the substrate. The substrate has multiple contact pads disposed thereon. The substrate also has multiple nuts formed therein for connecting to one or more bolts. The method also includes placing the semiconductor IC inside the guide structure such that the semiconductor IC makes contact with the contact pads. A top plate is disposed on the semiconductor IC. Further, the top plate and the semiconductor IC are fastened to the substrate.