An electronic component mounting system is disclosed. An elapsed time acquiring section acquires an elapsed time from printing onto circuit board by solder printer. A raising and lowering operation changing section changes raising and lowering operation of component holding tool based on the elapsed time from printing acquired by the elapsed time acquiring section. A mounter mounts an electronic component on the solder printed on circuit board by performing raising and lowering of the component holding tool at the raising and lowering operation changed by the raising and lowering operation changing section.

A soldering alloy includes an alloy composition consisting of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni, and a balance Sn. A soldering alloy, a soldering paste, a preform solder, a soldering ball, a wire solder, a resin flux cored solder and a solder joint, each of which is composed of the soldering alloy. An electronic circuit board and a multi-layer electronic circuit board joined by using the solder joint.

A flux resin composition contains: 60-80% by weight of an epoxy resin; 0.01-2% by weight of an imidazole compound; 1-5% by weight of a thixo agent; 4-20% by weight of an activator; and 7-30% by weight of a phenolic compound. The epoxy resin contains at least one resin selected from the group consisting of naphthalene type epoxy resins, biphenyl aralkyl type epoxy resins, trisphenol methane type epoxy resins, biphenyl type epoxy resins, and dicyclopentadiene type epoxy resins. Content of the at least one resin falls within a range from 15% by weight to 40% by weight with respect to a total weight of the flux resin composition. The phenolic resin is liquid and contains a phenol novolac.

The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.

A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

A method for manufacturing a wiring substrate includes preparing a first support plate having a metal foil formed on surface of a support substrate, forming a wiring substrate on the foil such that the wiring substrate has first surface facing the foil, attaching a second support plate to second surface of the wiring substrate, and separating the support substrate from the foil after attaching the second support plate such that the foil is removed from the first surface and that the first surface is exposed. The wiring substrate has first conductor pads on the first surface, and second conductor pads on the second surface, and the method includes conducting first inspection such that conduction between the second pads is inspected before attaching the second plate to the second surface, and conducting second inspection such that conduction between the first pads is inspected after removing the foil from the first surface.

A method for producing an electronic sensor module includes applying first soldering material onto electrical soldering pads of a printed circuit board element and/or electrical soldering pads of a printed circuit board element contact side of a sensor carrier, arranging the sensor carrier with the electrical soldering pads of the printed circuit board element contact side on the electrical soldering pads of the printed circuit board element to produce electrical connections between connecting lines and the printed circuit board element, applying second soldering material onto electrical connecting elements of a sensor element and/or soldering pads of the sensor receptacle, arranging the sensor element in the sensor receptacle such that the second soldering material produces electrical connections between the electrical connecting elements of the sensor element and the soldering pads of the sensor receptacle, and reflow-soldering the first soldering material and the second soldering material in a joint reflow-soldering process.

A soldering material (1) for active soldering, in particular for active soldering of a metallization (3) to a carrier layer (2) comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.

A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.

An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.