This flux transfer apparatus (10) comprises: a stage (12) having a recessed portion (13) for collecting flux (51); a flux pot (20) which is an annular member having a through hole (21) into which the flux (51) is introduced, which reciprocates along a top surface (14) of the stage (12) to supply the flux (51) that has been introduced into the through hole (21) into the recessed portion (13), and which levels off the top surface of the flux using a bottom surface (22); and a cooling mechanism (30) for cooling the stage (12). By this means, a rise in the temperature of the stage in the flux collecting apparatus is suppressed.

Provided is flux for resin flux cored solder using in a soldering method in which the resin flux cored solder is supplied into a through hole formed along a central axis of a soldering iron. The flux contains volatile rosin in an amount of 70 wt % or more and 98 wt % or less, non-volatile rosin in an amount of 0 wt % or more and 10% or less, and an activator in an amount of 2 wt % or more and 30 wt % or less, the activator including an organic acid in an amount of 0 wt % or more and 15 wt % or less, an organohalogen compound in an amount of 0.5 wt % and 15 wt % or less, an amine in an amount of 0 wt % or more and 5 wt % or less, and an amine hydrohalide salt in an amount of 0 wt % or more and 2.5 wt % or less.

A multilayer ceramic capacitor includes a laminate including dielectric layers and internal electrode layers, and external electrodes on surfaces of the laminate. A silane coupling agent layer is on at least a mounting surface among surfaces of the laminate. The silane coupling agent layer is made of a fluorine-based silane coupling agent, and a silane coupling agent concentration on the mounting surface is about 0.1 or higher and about 365 or lower and is higher than a silane coupling agent concentration on a counter surface opposing the mounting surface, or the silane coupling agent layer is made of a carbon-based silane coupling agent, and a silane coupling agent concentration on the mounting surface is about 0.91 or higher and about 38.10 or lower and is higher than a silane coupling agent concentration on a counter surface opposing the mounting surface.

The present invention provides a method for manufacturing a backlight source. The method for manufacturing a backlight source according to the present invention forms a plurality of tin soldering pattern groups on a substrate. Each tin soldering pattern group includes tin soldering patterns spaced from one another, and the tin soldering patterns are in a closed ring shape. The Mini-LEDs are disposed on the tin soldering pattern groups respectively. The substrate is placed in the space having a varying magnetic field. The circuit of the tin soldering patterns in the tin soldering pattern groups generates the induced current for rapid heating and melting, to solder the Mini-LEDs on the substrate. The soldering speed is improved, the process efficiency is high, the process cost is low, and the light effect of the backlight source is effectively ensured.

A multilayer wiring board includes first and second insulating layers, a first conductive wiring layer on the first insulating layer, a second conductive wiring layer on a surface of the second insulating layer facing the first insulating layer, an interlayer connection conductor including an intermetallic compound and penetrating through the first insulating layer to interconnect the first and second conductive wiring layers, a first intermetallic compound layer between the first conductive wiring layer and the interlayer connection conductor, and a second intermetallic compound layer between the second conductive wiring layer and the interlayer connection conductor, wherein the intermetallic compounds in the first and second intermetallic compound layers have a composition different from that of the intermetallic compound in the interlayer connection conductor, and the first intermetallic compound layer is located at a level different from a level of an interface between the first conductive wiring layer and the first insulating layer.

The present invention provides a two-component printable conductive composition comprising, as separate components, a metallic component comprising a high melting point (HMP) metal or metal alloy powder having a mean particle size below about 15 μm; and a fluxing component comprising an organic acid and an organic solvent. The organic acid is characterized by having at least two carboxylic groups and a first logarithmic acid dissociation constant (p K.sub.a1) of at most about 4. These two components are manufactured and stored separately and are mixed together shortly before the combined conductive composition is used for printing. Further provided is a kit comprising the two-component composition, wherein the metallic component and the fluxing component are disposed in separate containers. The present 10 invention further provides a method for deposition and patterning of the two-component composition, comprising: mixing the metallic component with the fluxing component; and applying the obtained mixture to an insulating substrate.

A method of manufacturing an electronic module includes supplying paste to an electronic component and/or a wiring board. The paste includes solder powder and first resin. The method includes supplying second resin to the electronic component and/or the wiring board. The method includes placing one of the electronic component and the wiring board on another. The method includes curing the second resin to form a second resin portion. The method includes heating the paste to a temperature equal to or higher than a solder melting point after the second resin portion is formed. The method includes solidifying molten solder at a temperature lower than the solder melting point to form a solder portion that bonds the electronic component and the wiring board. The method includes curing the first resin after the solder portion is formed, to form a first resin portion.

The present invention provides a two-component printable conductive composition comprising, as separate components, a metallic component comprising a high melting point (HMP) metal or metal alloy powder having a mean particle size below about 15 m; and a fluxing component comprising an organic acid and an organic solvent. The organic acid is characterized by having at least two carboxylic groups and a first logarithmic acid dissociation constant (p K.sub.a1) of at most about 4. These two components are manufactured and stored separately and are mixed together shortly before the combined conductive composition is used for printing. Further provided is a kit comprising the two-component composition, wherein the metallic component and the fluxing component are disposed in separate containers. The present 10 invention further provides a method for deposition and patterning of the two-component composition, comprising: mixing the metallic component with the fluxing component; and applying the obtained mixture to an insulating substrate.

A solder composition contains: flux composition containing (A) rosin-based resin, (B) activator, and (C) solvent; and (D): solder powder with a melting point of 200 to 250 degrees C. The component (A) contains (A1) rosin-based resin with a softening point of 120 degrees C. or more and an acid number of 220 mgKOH/g or more and (A2) rosin-based resin with a softening point of 100 degrees C. or less and an acid number of 20 mgKOH/g or less. The component (C) contains (C1) hexanediol solvent with a melting point of 40 degrees C. or more and a boiling point of 220 degrees C. or less and (C2) solvent with a viscosity of 10 mPa.Math.s or less at 20 degrees C. and a boiling point of 270 degrees C. or more. A content of the component (A1) ranges from 15 to 25 mass % with respect to the flux composition (100 mass %).

A system for flux residue detection is provided. The system includes a flux heater, where the flux heater controls a temperature of a flux spray applied to a printed circuit board, and an infrared camera, wherein the infrared camera provides a thermal image of the flux on the printed circuit board. A method, a computer system, and a computer program product for flux residue detection is provided, including setting flux application parameters, applying flux to a printed circuit board, and capturing an infrared image of the flux applied to the printed circuit board. A method, a computer system, and a computer program product for flux residue detection is provided, including setting flux application parameters, applying flux to a printed circuit board, capturing an infrared image of the flux applied to the printed circuit board, and determining there is excess flux residue on the printed circuit board.