A reflowable grid array (RGA) interposer includes first connection pads on a first surface of a body and second connection pads on a second surface of the body. Heating elements within the body are adjacent to the second connection pads. First interconnects within the body connect some of the second connection pads to the first connection pads. Second interconnects within the body connect pairs of the second connection pads. A motherboard assembly includes first and second components (e.g., CPU with co-processor and/or memory) and the RGA interposer. The first connection pads are in contact with motherboard contacts. The second connection pads are in contact with the first and second components. The first component passes signals directly to the motherboard by the first interconnects. The second component passes signals directly to the first component by the second interconnects but does not pass signals directly to the motherboard by the first interconnects.

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.

An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard.

A printing device includes a storage that stores allowable time for which use of solder supplied to a screen mask can be allowed, a timer that measures time for which the solder is supplied to the screen mask, a determination unit that determines whether or not the solder supplied to the screen mask has exceeded the allowable time based on time measured by the timer, and a notifier that notifies a worker in a case where the determination unit determines that the solder supplied to the screen mask has exceeded the allowable time. The timer measures time by weighting a measurement interval of time for which the solder is moved on the screen mask by a squeegee so as to become greater than a measurement interval of time for which the solder does not move on the screen mask.

A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.

Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process.

This disclosure relates to a soldering system containing a soldering apparatus and a heating apparatus. The soldering apparatus includes a heating plate having a body defining a plurality of first air exits, each first air exit extending through the body of the heating plate and the heating plate being configured to supply hot air through the first air exits; a cover disposed on the heating plate, the cover and the heating plate defining a hot air chamber; a plurality of axially movable positioning shafts extending though the body of the heating plate, in which each shaft has a first end and a second end, the first end is in the hot air chamber, and the second end is outside the hot air chamber; and a conduit attached to the cover, the conduit being configured to supply hot air to the hot air chamber.

A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.

A method of joining electronic components to an electronic substrate in an apparatus includes: (1) transporting electronic substrates through a chamber housing including a tunnel extending through multiple processing zones; (2) detecting temperatures of the electronic substrates passing proximate to a heat detection system including at least one temperature sensor coupled to the chamber housing; (3) receiving temperature data from the heat detection system with a controller coupled to the multiple processing zones, the conveyor, and the heat detection system; (4) determining, by the controller, with reference to the detected temperatures of the electronic substrates, an adjustment to at least one of (a) a heat setting of a heating element within the chamber housing, (b) a speed of the conveyor, and (c) an operational speed of a blower within the chamber housing; and (5) performing the determined adjustment.

A method for producing a wired circuit board, including an insulating layer having a first through portion passing through in a thickness direction thereof and a first terminal portion having a second through portion overlapped with the first through portion when projected in the thickness direction, includes the steps of providing a first bonding material at one surface in the thickness direction of the first terminal portion and allowing the first bonding material to flow from the one surface in the thickness direction of the first terminal portion toward the other surface in the thickness direction thereof into the second through portion by allowing the first bonding material to flow.