Method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.

A method of forming a molded interconnect device (MID) is provided. The method includes the steps of performing a molding stage, performing a circuit forming stage, and performing a plate stage. As a part of the molding stage, a palladium-catalyzed material is injection molded into a palladium-catalyzed substrate of a desired shape. As a part of the circuit forming stage, both a metallization step and a circuit patterning step are performed. As a part of the plating stage, both an electrolytic plating step and a circuit isolation step are performed.

A wiring board according to the present disclosure includes a core board including an upper surface, a lower surface, a through-hole penetrating from the upper surface to the lower surface, and a plurality of glass fibers located inside, and a through-hole conductor located in the through-hole. The through-hole conductor includes a first portion located on an inner wall of the through-hole, and second portions connected to the first portion and located inside the glass fibers. The second portions include portions in a first direction and a second direction intersecting the first direction in a planar direction of the core board, the portions having a shorter length in the planar direction from the inner wall of the through-hole than portions, of the second portions, in directions other than the first direction and the second direction.

A glass wiring board in which a glass substrate with a small thickness is used as a core substrate to prevent glass breakage during manufacture, and an analog splitter composed of a capacitor and an inductor is formed on the glass substrate so as to stabilize the electrical properties of the analog splitter. An inductor is formed using a through electrode which is in contact with an inorganic adhesive layer on a glass substrate on which the inorganic adhesive layer is formed. A capacitor is formed using an insulating resin opening part formed in an insulating resin layer covering the glass substrate having wiring. The inductor and the capacitor are formed on different layers.

By interposing a hard mask between a dielectric and photo-sensitive material it is possible to form fine via in the dielectric by dry etching without damaging the remaining surface of the dielectric.

A method for producing a glass substrate according to the present invention includes the steps of: (I) forming a through hole (11) in a glass sheet (10); (II) forming a resin layer (20) on a first principal surface of the glass sheet (10) using a resin composition sensitive to light having a predetermined wavelength λ.sub.1; (III) photoexposing an area of the resin layer (20) that covers the through hole (11) by irradiating the area with light U having the wavelength λ.sub.1 and applied from the direction of a second principal surface of the glass sheet (10); and (IV) forming a through-resin hole (21) by removing the area photoexposed in the step (III). The glass sheet (10) protects the resin layer (20) from the light U so as to prevent the resin layer (20) from being photoexposed by beams of the light U that are incident on the second principal surface of the glass sheet (10) in the step (III).

An electronic circuit including a substrate having a first dielectric characteristic. The substrate can include a first side and a second side. An intermediary material can be disposed within the substrate. For instance, the intermediary material can be located between the first side and the second side. The intermediary material can include a second dielectric characteristic, where the second dielectric characteristic is different than the first dielectric characteristic. A first conductive layer can be disposed on the first side, and a second conductive layer can be disposed on the second side. A conductive path can be electrically coupled between the first conductive layer and the second conductive layer. The conductive path can be in contact with at least a portion of the intermediary material.

A method for plating a printed circuit board, includes placing a substrate, including a through hole, in contact with a plating solution and disposing the substrate to face an electrode; and applying a pulsed current to each surface of the substrate, including applying pulsed currents of opposite polarity to both surfaces of the substrate at least once and applying pulsed forward currents to both surfaces of the substrate at least once, to plate from a middle to an end of the through hole.

A multilayer substrate includes a plurality of plates laminated in a thickness direction of the multilayer substrate, a resin layer provided between the plurality of plates adjacent in the thickness direction, an internal conductive layer provided between the plurality of plates adjacent in the thickness direction, and an external conductive layer provided over an outer surface of each plate of the plurality of plates located at both ends in the thickness direction, wherein a total thickness of the internal conductive layer and the external conductive layer is equal to or less than 25% of a total thickness of the plurality of plates.

A conductive network fabrication process is provided and includes filling a hole formed in a substrate with dielectric material, laminating films of the dielectric material on either side of the substrate, opening a through-hole through the dielectric material at the hole, depositing a conformal coating of dielectric material onto an interior surface of the through-hole and executing seed layer metallization onto the conformal coating in the through-hole to form a seed layer extending continuously along an entire length of the through-hole.