A wiring board and a method of manufacturing the same are provided. The method includes the following steps. A substrate is provided. The substrate is perforated to form at least one through hole. A first conductive layer is integrally formed on a surface of the substrate and an inner wall of the through hole. An etch stop layer is formed on a portion of the first conductive layer on the surface of the substrate and another portion of the first conductive layer on the inner wall of the through hole. A second conductive layer is integrally formed on the etch stop layer and the first conductive layer on the inner wall of the through hole. A plug-hole column is formed by filling with a plugged-hole material in the through hole. The second conductive layer is removed. The etch stop layer is then removed.

A wiring substrate includes an insulating layer having a through hole, a first conductor layer formed on a first surface of the insulating layer, a second conductor layer formed on a second surface of the insulating layer, an interlayer connection conductor formed in the through hole such that the interlayer connection conductor is connecting the first and second conductor layers, and a resin body formed in the through hole of the insulating layer such that a volume occupancy rate of the resin body is in a range of 30% to 55% in the through hole. The interlayer connection conductor is formed such that the interlayer connection conductor has a length in a range of 1000 μm to 2000 μm in a thickness direction of the insulating layer and that a volume occupancy rate of the interlayer connection conductor is in a range of 45% to 70% in the through hole.

A printed circuit board includes a first insulating layer disposed on a flexible region and a rigid region; and a first wiring layer disposed on one surface of the first insulating layer in the rigid region and the flexible region. A thickness of the first wiring layer in at least a portion of the rigid region is greater than a thickness of the first wiring layer in the flexible region.

The present disclosure relates to the technical field of circuit boards, and provides an embedded circuit board and a method for manufacturing the embedded circuit board. The embedded circuit board includes: a first outer wiring board, a base board, and a second outer wiring board. The base board has at least one groove, the first outer wiring board, the base board and the second outer wiring board define through holes to form a resonant chamber. A minimal distance between the side walls of the groove and the side walls of the adjacent through holes is 50 um-400 um. An electronic device is received in the groove.

A circuit board according to an embodiment includes an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes a copper foil layer disposed on the insulating layer, a first plating layer disposed on the copper foil layer, and a second plating layer disposed on the first plating layer, and wherein the copper foil layer has a thickness in a range of 2 μm to 5 μm.

The present disclosure relates to the technical field of circuit boards, and provides an embedded circuit board and a method for manufacturing the embedded circuit board. The embedded circuit board includes: a first outer wiring board, a base board, and a second outer wiring board. The base board has at least one groove, the first outer wiring board, the base board and the second outer wiring board define through holes to form a resonant chamber. A minimal distance between the side walls of the groove and the side walls of the adjacent through holes is 50 um-400 um. An electronic device is received in the groove.

A printed circuit board with high-capacity and high-current copper circuit includes a conductive trace, a first protecting layer, and a second protecting layer on opposite sides of the conductive trace. The conductive trace includes a basic conductive trace pattern, a first conductive trace pattern, and a second conductive trace pattern. The first and second conductive trace patterns are directly formed on opposite surfaces of the basic copper conductive trace pattern. A width of trace of the first conductive trace pattern is the same as a line width of the second conductive trace pattern.

A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate conductor layers, second conductor layers including second inner, outer and intermediate conductor layers, interlayer insulating layers interposed between the first conductor layers and between the second conductor layers, and via conductors formed in the core layer such that each via conductor decreases in diameter from one of the inner conductor layers toward the other one of the inner conductor layers and that the other one of the inner conductor layers has thickness greater than thickness of the one of the inner conductor layers. The first and/or second inner conductor layers includes a first laminated structure including metal foil and plating film layers, the first and/or second outer conductor layers includes the first laminated structure, and the first and/or second intermediate conductor layers includes a second laminated structure including metal foil and plating film layers.

A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.

A printed wiring board includes an insulating substrate, a first conductor layer formed on a first surface of the substrate, a second conductor layer formed on a second surface of the substrate, and through-hole conductors formed through the substrate and connecting the first and second conductor layers. The substrate has openings formed such that each opening extends from the first to second surfaces of the substrate, and magnetic material filling the openings and forming through holes such that each through hole extends from the first to second surfaces of the substrate, the through-hole conductors are formed on sidewalls of the through holes in the magnetic material, and the magnetic material includes resin and particles including magnetic metal such that the particles include a group of particles forming the sidewalls of the through holes and that each particle in the group has a substitution plating film formed on a surface thereof.