A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.

A printed wiring board includes a substrate having first and second surfaces such that the substrate has a thickness in a range of 30 m to 100 m between the first and second surfaces, and through hole conductors including plating material such that the through hole conductors are formed in through holes extending from the first surface to the second surface. Each through hole has a first opening portion and a second opening portion connected to the first opening portion such that the first opening portion has a tapered shape decreasing in diameter from the first surface toward the second surface, the second opening portion has a tapered shape decreasing in diameter from the second surface toward the first surface, and center lines of the first and second opening portions are shifted from each other by a distance that is equal to or less than the thickness of the substrate.

A multilayer PCB having may include a first sub-composite core having a first core structure sandwiched between a first conductive layer and a second conductive layer, the first core structure including one or more dielectric and conductive layers. A first via hole extends at least partially through the first core structure, wherein an inner surface of the first via hole is plated with a conductive material along a first via segment electrically coupling the first conductive layer to an internal layer or trace within the first core structure. A second via segment extending between the second conductive layer and the internal layer or trace is devoid of the conductive material such that the first via hole is substantially stub free. A first dielectric layer is coupled to the second conductive layer. A second sub-composite core coupled to the first dielectric layer.

A substrate that enables increasing an allowable current value of a current path in a thickness direction of the substrate and narrowing spaces between multiple current paths, and the like are provided. To solve this subject, a substrate includes a sheet-shaped first base material (1) having a penetrating hole (1B) in the thickness direction and includes a second base material (2) fitted into the penetrating hole (1B). The second base material (2) includes multiple metal bodies (2B). The metal bodies (2B) penetrate in the thickness direction of the first base material (1) in a state of having an end exposed at each of a first surface and a second surface of the second base material (2) that face each other in the thickness direction.

According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 m at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 m at the second major surface and fully fills the via between the first cavity and the second cavity.

A wiring substrate includes a flexible insulation substrate, a first wiring layer formed on an upper surface of the insulation substrate, a second wiring layer formed on a lower surface of the insulation substrate, and through wiring bonded to the first wiring layer and the second wiring layer and formed in a through hole extending through the first wiring layer, the insulation substrate, and the second wiring layer. The through wiring includes a projection that extends along a lower surface of the second wiring layer located outside the through hole. An upper surface of the through wiring is flush with an upper surface of the first wiring layer.

A wiring substrate includes a flexible insulation substrate, a first wiring layer formed on an upper surface of the insulation substrate, a second wiring layer formed on a lower surface of the insulation substrate, and through wiring bonded to the first wiring layer and the second wiring layer and formed in a through hole extending through the first wiring layer, the insulation substrate, and the second wiring layer. The through wiring includes a projection that extends along a lower surface of the second wiring layer located outside the through hole. An upper surface of the through wiring is flush with an upper surface of the first wiring layer.

A flexible printed circuit board (PCB), a method for manufacturing the flexible PCB, and a PCB structure having the flexible PCB are disclosed. A flexible printed circuit board includes a first conductive pattern layer, a second conductive pattern layer, a plurality of first conductive pillars, and a plurality of second conductive pillars. Each of the plurality of first conductive pillars electrically connects to the first conductive pattern layer and is spaced from the second conductive pattern layer, and a plurality of second conductive pillars electrically connects to the second conductive pattern layer and is spaced from the first conductive pattern layer. The plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads.

The present invention discloses a method for manufacturing a printed circuit board having an ultra-thin metal layer. The method discharges alkaline aliphatic amine gas and the nitrogen bubbled in the cupric sulfate solution via capacitive coupling in a vacuum, to generate low temperature plasma. The polyimide film and the epoxy resin board coated with fiberglass cloth are etched and the surface is treated to graft active groups, so as to increase the surface roughness and chemical activity. Subsequently, sputtering copper plating or chemical copper plating is directly conducted. The electroplating is conducted to thicken the copper film to a required thickness. The method of the invention not only does not need adhesive (adhesive free), but also has a high peeling strength. It can be used for the preparation of the flexible PCB, the rigid PCB, the multi-layer PCB, and rigid-flex PCB, having an ultra-thin metal layer.

A method of manufacturing support elements for lighting devices includes: providing an elongated, electrically non-conductive substrate with opposed surfaces, with an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along the non-conductive substrate with at least one portion of the non-conductive substrate left free by the set of electrically-conductive tracks, forming a network of electrically-conductive lines coupleable with at least one light radiation source at said portion of said non-conductive substrate left free by the electrically-conductive tracks. Said forming operation includes selectively removing e.g. via laser etching a further electrically-conductive layer provided on said non-conductive substrate, or printing electrically-conductive material onto the non-conductive substrate. The electrically-conductive tracks and the network of electrically-conductive lines may be coupled with each other e.g. by means of electrically-conductive vias extending through the non-conductive substrate.