Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.

A method of manufacturing a component carrier, wherein the method comprises stamping a surface profile in a design layer, forming a metallic base structure in at least one indentation of the profiled design layer at least partially by electroplating, and electroplating an electroplating structure in the at least one indentation on or above the metallic base structure.

A substrate structure includes a substrate and a vertical conductive connector. The substrate includes a material with a heat resistance temperature of 300 C. or greater. The vertical conductive connector penetrates through the substrate. The vertical conductive connector has a bonding structure extending toward the substrate. A manufacturing method of the substrate structure is also provided.