Provided are a thermoplastic liquid crystal polymer film having an improved thermo-adhesive property, a circuit board, and methods respectively for producing the same. The thermoplastic liquid crystal polymer film has a segment orientation ratio SOR of 0.8 to 1.4 and a moisture content of 300 ppm or less. The circuit board contains a plurality of circuit board materials wherein the circuit board materials are at least one member selected from the group consisting of an insulating substrate having a conductor layer on at least one surface, a bonding sheet, and a coverlay. At least one of the circuit board materials includes a thermoplastic liquid crystal polymer film. The circuit board shows a solder heat resistance when the circuit board is placed in a solder bath at 290 C. for 60 seconds in accordance with JIS C 5012.

A printed wiring board includes a resin insulating layer, a conductor layer formed on a surface of the resin insulating layer, an outermost insulating layer formed on the resin insulating layer such that the outermost insulating layer is covering the conductor layer and has an opening extending to the conductor layer, and a metal post formed in the opening of the outermost insulating layer such that the metal post is protruding from the outermost insulating layer.

The invention relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations in order to facilitate shipping and subsequent removal of the flexible substrate from the carrier, the process comprising the steps of:

providing a flexible substrate comprising a plurality of integrated circuits thereon;
providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier;
changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.

An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.

A method is for making an electronic device including forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein, the multilayer circuit board including at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The method also includes filling the membrane switch recess with air, and positioning at least one biasing member in the membrane switch recess.

A multilayer substrate includes a base including insulating layers stacked on one another, a first principal surface, and a second principal surface, a heat transfer member extending through a first insulating layer nearest to the first principal surface, a second coefficient of thermal conductivity of a material of the heat transfer member is higher than a first coefficient of thermal conductivity of a material of the insulating layers, a first metal film adhered to the first principal surface, the first metal film overlapping the heat transfer member when viewed from the layer stacking direction, and a first joining member disposed between the heat transfer member and the first metal film and being made of a material with a coefficient of thermal conductivity which is higher than the first coefficient of thermal conductivity of the material of the insulating layers.

A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

A multilayer board insulating sheet contains a reducing agent.

A thick conductor built-in type printed wiring board includes a printed wiring board, an insulating resin layer, an insulating base material layer, and a conductor layer. The printed wiring board includes an insulating layer including a cured product of a first resin composition, and a circuit provided on one main surface or both main surfaces of the insulating layer, the circuit having a plurality of conductor wirings each having a thickness ranging from 105 m to 630 m, inclusive. The insulating resin layer covers a surface of the printed wiring board on which the circuit is provided, and includes a cured product of a second resin composition and includes no fibrous base material. The insulating base material layer covers the insulating resin layer, and includes a cured product of a third resin composition and a fibrous base material. The conductor layer covers the insulating base material layer. The thick conductor built-in type printed wiring board does not include a void having a diameter of more than or equal to 10 m inside the thick conductor built-in type printed wiring board.

An electronic component includes an insulating base material substrate including a first main surface defining a mounting surface, a coil on the insulating base material substrate, and a mounting electrode on the first main surface and connected to the coil. The insulating base material substrate includes insulating base material layers laminated in a lamination direction. The coil includes a coil conductor provided on one of the insulating base material layers and a winding axis extending in the lamination direction. An area of the first main surface is smaller than an area of a section different in area from the first main surface and is closest to the first main surface, among sections parallel or substantially parallel to the first main surface.