A circuit board structure includes a circuit board and an adhesive layer. The circuit board has a first board surface and an opposite second board surface, and the first board surface defines a predetermined portion. The circuit board has a conductive circuit disposed on the first board surface and at least partially arranged on the predetermined portion. The adhesive layer is seamlessly formed on the predetermined portion of the first board surface of the circuit board, and the conductive circuit arranged on the predetermined portion is seamlessly covered by the adhesive layer. A surface of the adhesive layer arranged away from the circuit board is a planar bonding surface.

A film composite with electrical functionality for application on a substrate includes at least one conductive structure, a first bonding coat, a film layer and a second bonding coat. The first bonding coat is disposed on an underside of the at least one conductive structure, wherein the first bonding coat has an adhesive effect for application of the at least one conductive structure on the substrate. The second bonding coat is disposed between an upper side of the at least one conductive structure and the film layer. The second bonding coat has an adhesive effect, by which the film layer adheres to the at least one conductive structure.

A flexible circuit board including: a body area including a plurality of wirings; a bonding area combined with a first side of the body area; and an extension area combined with a second side of the body area opposite to the first side. The body area includes a first sub-body area and a second sub-body area located on a side of the first sub-body area close to the extension area; the plurality of wirings at least include a first wiring, a second wiring and a third wiring all extend in the first sub-body area, and the first wiring and the second wiring extend in the second sub-body area. The first sub-body area includes a multi-layer board structure, the second sub-body area includes a single-layer board structure or a double-layer board structure, and a thickness of the second sub-body area is smaller than a thickness of the first sub-body area.

A biphasic composition comprises a quantity of liquid GaIn and a plurality of solid particles of Ga.sub.2O.sub.3 suspended in the quantity of liquid GaIn, the Ga.sub.2O.sub.3 particles having a median particle size between 8 μm and 25 μm, wherein the volumetric ratio of solid particles of Ga.sub.2O.sub.3 to liquid GaIn is between 0.4 and 0.7. A method of making a biphasic composition of GaIn, a method of making a stretchable circuit board assembly, and a stretchable circuit board assembly are also described.

A flexible printed circuit and a display device are provided. The flexible printed circuit includes: a plurality of sub-circuit boards arranged in a stack, wherein the plurality of sub-circuit boards include at least a first sub-circuit board and a second sub-circuit board; and a pressure sensor arranged on the first sub-circuit board, wherein the first sub-circuit board includes: a substrate film; a conductive film arranged on a side of the substrate film away from the second sub-circuit board; an adhesive layer arranged on a side of the conductive film away from the substrate film; a cover layer arranged on a side of the adhesive layer away from the substrate film; and an electromagnetic shielding layer arranged on a side of the cover layer away from the substrate film, wherein at least a part of the conductive film is formed as an electrode of the pressure sensor.

A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.

Wireless sensor devices are described which harvest energy and provide an antenna or antennas for wireless communication on a relatively small form factor, preferably one that is co-extensive with a largest component of the device, e.g., an antenna layer or sensor layer. The devices are able to sense and/or control certain specific parameters of a system; store energy, e.g., in a supercapacitor system or battery system; transmit that as information/signals via a wireless link, e.g., RF or optical link; receive information from other devices and relay that information. Such devices accordingly may be self-powered and wireless devices, and not dependent on a separate device or form factor to provide a power source. Such devices can be entirely autonomous or substantially so, can be mobile or fixed, and may require little servicing over a period of time. The devices can be used as sensor nodes in a wireless mesh network.

A lighting device including a light-emitter including light emitting elements, and a support having a first surface that carries a wiring line electrically connecting element electrodes of the light emitting elements and a light emitting surface, and a substrate including a base substrate, a conductor formed on a first surface of the base substrate, an adhesive member formed on a second surface of the base substrate, and a through-hole penetrating the substrate. A space is formed between the substrate and the light-emitter to communicate with a bottomed hole formed in a location of the through-hole as a result of adhering an adhesive surface of the adhesive member to a surface of the light-emitter having the wiring line formed thereon. The wiring line is connected to the conductor via a filler filling the bottomed hole, and the space is located outside an opening of the bottomed hole.

A flexible printed circuit board includes a power wiring layer transmitting power and a signal wiring layer insulated and stacked over or under the power wiring layer.

A method for manufacturing a flexible circuit board includes providing a first laminated structure, the first laminated structure including two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure. The first conductive structure penetrates the two first wiring boards and the first adhesive layer and electrically connects the two first wiring boards. The first adhesive layer defines a first opening, the first opening includes a first edge away from the first conductive structure. The first laminated structure is cut along the first edge and then the two first wiring boards are unfolded. A flexible circuit board manufactured by such method is also disclosed.