Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

Wireless sensor devices are described which harvest energy and provide an antenna or antennas for wireless communication on a relatively small form factor, preferably one that is co-extensive with a largest component of the device, e.g., an antenna layer or sensor layer. The devices are able to sense and/or control certain specific parameters of a system; store energy, e.g., in a supercapacitor system or battery system; transmit that as information/signals via a wireless link, e.g., RF or optical link; receive information from other devices and relay that information. Such devices accordingly may be self-powered and wireless devices, and not dependent on a separate device or form factor to provide a power source. Such devices can be entirely autonomous or substantially so, can be mobile or fixed, and may require little servicing over a period of time. The devices can be used as sensor nodes in a wireless mesh network.

A multilayered substrate includes first, second, and third insulating layers, and a transmission line. The first insulating layer includes first and second surfaces opposite to each other. A signal conductor of the transmission line is on the first surface of the first insulating layer. The second insulating layer is in contact with the first surface of the first insulating layer. The third insulating layer is in contact with the second surface of the first insulating layer. A dielectric loss of the second insulating layer is lower than a dielectric loss of the third insulating layer. A degree of close contact between the first insulating layer and the third insulating layer is higher than a degree of close contact between the first insulating layer and the second insulating layer.

Described are processes for developing laminated circuit boards, as well as the resulting circuit boards themselves. Accordingly, at least two circuit boards at least partially overlap each other, and at least one through-hole is formed in an overlapping region thereof. The through-hole is filled with an electrically-conductive material, forming a through-via that enables the circuit boards to be electrically connected. When a circuit on each circuit board is laid out so that a part thereof reaches a region in which the through-via is to be formed, then that part of the circuit can be electrically connected to the through-via. Thus, portions of the circuits on the circuit boards can be electrically connected to each other via common through-vias to realize an integrated device in which the circuits on the laminated circuit boards function.

A multi-layered electronic device including two or more stacked metal conducting layers, a dielectric layer disposed between metal conducting layers, and at least one electrical connection extending between contact pads of metal conducting layers and through a through hole of the dielectric layer is provided. A system including at least one multi-layered electronic device, a satellite coupled to at least one multi-layered electronic device, and a controller hub electrically connected to the multi-layered electronic device via the satellite is also provided. A method of manufacturing the multi-layered electronic device including forming first and second first metal conducting layers, depositing a dielectric layer adjacent to the metal conducting layers, and connecting the metal conducting layers is also provided.

A multilayer substrate includes a stacked body including first and second flexible insulating base material layers, and an actuator conductor pattern on at least the first insulating base material layer. The stacked body includes a first region including stacked first and second insulating base material layers, and a second region including stacked second insulating base material layers. The first region includes an actuator function portion in a portion thereof, the actuator function portion including the actuator conductor pattern. The thickness of the first insulating base material layer including the actuator conductor pattern is smaller than the thickness of one second insulating base material layer.

Forming, in a printed-wiring board, a via sufficiently filled without residual smear, for use in an insulating layer and the size of the via to be formed. A via of a printed-wiring board comprises a first filling portion which fills at least a center portion of a hole, and a second filling portion which fills a region of the hole that is not filled with the first filling portion. An interface which exists between the second and first filling portions, or an interface which exists between the second filling portion and an insulating layer and the first filling portion has the shape of a truncated cone comprising a tapered surface which is inclined to become thinner from a first surface toward a second surface, and an upper base surface which is positioned in parallel to the second surface and closer to the first surface than to the second surface.

Disclosed is a method of manufacturing a transmission line using a nanostructured material. The method includes locating a first insulating layer above a first nanoflon layer including nanoflon, forming a first conductive layer above the first insulating layer, forming a first pattern, which transmits and receives a signal, by etching the first conductive layer, and locating a first ground layer below the first nanoflon layer. Here, the nanoflon is a nanostructured material formed by electrospinning a liquid resin at a high voltage.

At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side. The printed circuit board illustratively further includes a thermally conductive, electrically insulating additive resin filling spaces between the electrically conductive material in both the first and second patterned layers of each of the plurality of double-sided laminates, such that the electrically conductive material and the additive resin together form planar surfaces that contact the plurality of pre-preg sheets.

A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.