A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

The abstract of the international application is being replace by the following abstract: The purpose of the present invention is to provide: a novel triazole silane compound and a method for synthesizing the same, and a silane coupling agent containing the triazole silane compound as a component; and a surface treatment solution, a surface treatment method, and a method for bonding two different materials, which use said triazole silane compound.

Discussed is a connection structure between a battery and a protection circuit module (PCM) in a battery pack in which a battery cell is connected to the PCM. The battery cell can include a battery cell main body, and an electrode lead tab electrically connected with the battery cell main body. The PCM can include a printed circuit board (PCB), which can include an insulation board, a second copper foil layer in contact with a first surface of the insulation board, a first copper foil layer above the second copper foil layer, and a first prepreg layer between the first copper foil layer and the second copper foil layer. The electrode lead tab of the battery cell can directly contact the first copper foil layer of the PCM.

A curable epoxy composition comprising an epoxy compound (A), active ester compound (B), and triazine structure-containing phenol resin (C), wherein the epoxy compound (A) includes a polyvalent epoxy compound (A-1) which has an alicyclic condensed polyvalent structure in a ratio of content of 30 wt % or more is provided.

Described herein are systems and methods for creating a cavity within a substrate. The systems and methods may include passing a plasma gas over a first surface of the substrate. The plasma gas may include a reactant gas. The systems and methods also may include removing a portion of the substrate by reacting the reactant gas with a constituent of the first surface of the substrate, thereby forming the cavity.

Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.

An electronic module including one or more electronic components that are electrically connected to a multilayer PCB circuit comprises, on one face, electrical connection balls for the external electrical connection of the electronic module. The PCB circuit comprises a hermetically protective electrically insulating inorganic inner layer, and the module comprises six faces with an electrically insulating or conductive inorganic hermetic protection layer on the five faces other than that formed by the PCB circuit.

The disclosure provides a composite for forming an insulating substrate. The composite includes 100 parts by weight of a modified liquid crystal polymer and 0.5-85 parts by weight of a dielectric additive. The modified liquid crystal polymer has a repeating unit represented by

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in which Ar is 1,4-phenylene, 1,3-phenylene, 2,6-naphthalene, or 4,4-biphenylene, Y is O or NH, and X is carboxamido, imido/imino, am idino, aminocarbonylamino, aminothiocarbonyl, aminocarbonyloxy, aminosulfonyl, aminosulfonyloxy, aminosulfonylamino, carboxyl ester, (carboxyl ester)amino, (alkoxycarbonyl)oxy, alkoxycarbonyl, hydroxyamino, alkoxyamino, cyanato, isocyanato, or a combination thereof.

A printed circuit board according to an embodiment of the present invention, which is configured to be disposed on an inner surface of an airtight case having an opening so as to hermetically cover the opening, includes a shielding layer containing a liquid crystal polymer as a main component at least in a region covering the opening. An electronic component according to another embodiment of the present invention includes an airtight case having an opening and a printed circuit board disposed on an inner surface of the airtight case so as to hermetically cover the opening, wherein the printed circuit board includes a shielding layer containing a liquid crystal polymer as a main component at least in a region covering the opening.