A circuit board, in particular for a control device of a vehicle, includes a core made of at least two layers of resin impregnated glass textile and two conductor planes of the circuit board. The glass textile layers are disposed between the conductor planes and the conductor planes are on opposite sides of the core. The glass textile layers are each between 50 micrometers and 150 micrometers thick and have a resin content of between 58 percent by volume and 74 percent by volume. The conductor planes are each between 20 micrometers and 50 micrometers thick.

A wiring board includes a first insulating layer including a surface having unevenness, a second insulating layer including a surface having unevenness, laminated on the first insulating layer, and made of the same insulating material as that of the first insulating layer, insulating particles contained in the first and second insulating layers at rate of 40 to 80 wt %, a first wiring conductor on a first underlying metal layer surface, and a second wiring conductor on a second underlying metal layer surface. A second level difference of the unevenness in a surface region of the second insulating layer under the second wiring conductor is smaller than a first level difference of the unevenness in a surface region of the first insulating layer under the first wiring conductor, and the second level difference is not more than of an average particle size of the insulating particles.

A printed wiring board includes a first conductor layer including a first conductor circuit and a second conductor circuit formed adjacent to the first circuit, a resin insulating layer formed on the first conductor layer such that the insulating layer is filling space between the first and second conductor circuits, and a second conductor layer formed on the insulating layer such that distance (T) between the first and second conductor layers is in the range of 4.5 m to 10.5 m. The resin insulating layer includes inorganic particles having average particle diameter (D1) such that ratio (D1/S) of the diameter (D1) to distance (S) of the space is less than 0.25 and that ratio (D1/T) of the diameter (D1) to the distance (T) is less than 0.25, where the distance (S) of the space between the first and second conductor circuits is in the range of 4.5 m to 10.5.

A printed circuit board according to an embodiment of the present invention, which is configured to be disposed on an inner surface of an airtight case having an opening so as to hermetically cover the opening, includes a shielding layer containing a liquid crystal polymer as a main component at least in a region covering the opening. An electronic component according to another embodiment of the present invention includes an airtight case having an opening and a printed circuit board disposed on an inner surface of the airtight case so as to hermetically cover the opening, wherein the printed circuit board includes a shielding layer containing a liquid crystal polymer as a main component at least in a region covering the opening.

An inorganic filler includes surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.

A multi-layer circuit board capable of being applied with electrical testing includes a patterned metal-interface layer, a metallic delivery loading plate, an electrical connection layer, a conductive corrosion-barrier layer, a bottom dielectric layer, and a multi-layer circuit structure. The multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. The delivery loading plate and the patterned metal-interface layer expose the conductive corrosion-barrier layer. Therefore, before the multi-layer circuit board is packaged, an electrical testing can be applied to the multi-layer circuit board to check if it can be operated normally. Hence, costs for figuring out reasons of the unqualified electronic component can be reduced, and responsibilities for the unqualified electrical testing result of the electronic component can be clarified.

[Problem] To provide a curable resin composition which has a low linear expansion coefficient and high heat resistance, which can form a cured product in which the occurrence of void defects and the like is suppressed, and with which the toughness or a molded article can be maintained. [Solution] A curable resin composition comprising an epoxy compound (A), an epoxy curing agent (B), an inorganic filter (C), and a compound (D) including at least three ethylenically unsaturated bonds, wherein the ratio of the inorganic filler (C) in a non-volatile component exceeds 50 mass %.

A thermosetting polymer formulation includes: 40 to 90 volume percent of a thermosetting polymer system; 10 to 40 volume percent, preferably 20 to 35 volume percent, preferably 20 to 30 volume percent, of a plurality of hexagonal boron nitride platelets having a mean particle diameter of 5 to 20 micrometers, preferably 8 to 15 micrometers, and a D10 particle diameter of 3 to 7 micrometers, preferably 3 to 5 micrometers, and a D90 particle diameter of 20 to 30 micrometers, preferably 25 to 30 micrometers; a total of 0.01 to 10 volume percent of a coupling agent, an impact modifier, a curing agent, a defoamer, a colorant, a thickening agent, a release agent, an accelerator, or a combination comprising at least one of the foregoing, wherein the volume percentages are based on the total volume of the formulation.

A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.

An epoxy resin exhibits a small change in volume after thermal history, is excellent in low thermal expansion and low moisture absorption, and has high heat resistance, in terms of a cured product obtained therefrom; a curable resin composition; a cured product which has all the above properties; a semiconductor encapsulating material; a semiconductor device; a prepreg; a circuit board; a buildup film; a buildup substrate; a fiber-reinforced composite material; and a molded article. The present invention is characterized by an epoxy resin, characterized by including as essential components, a cresol-naphthol co-condensed novolac type epoxy resin (A), a naphthol glycidyl ether compound (B), and one or more xanthene compounds (C) selected from the group of compounds represented by the following structural formulae (1) to (3), wherein the content of the xanthene compound(s) (C) is from 0.1% to 5.5% in terms of area ratio in a GPC measurement. ##STR00001##