A socket connector includes a housing having a top, a bottom, a first side wall and a second side wall forming cavities that receive power sockets. The housing includes pin access openings through the bottom that receive power pins mated to the power sockets. Each power socket includes a cable socket receiving a power cable and a pin socket that receives the power pin. The power socket electrically connects the power cable and the power pin. The socket connector includes latches each having a latch release and a latch arm operably coupled to the latch release. The latch arm extends along the corresponding pin access opening and includes a latching surface aligned with the pin access opening configured to engage the power pin to retain the power pin in the housing. The release button is actuated to release the latch arm from the power pin and allow removal of the power pin from the housing.

A modular high density communications chassis, comprising a chassis and slidable carrier module is provided. The chassis comprises a second track having a first and second stage access fixing recess and a sectional sliding mechanism having a moveable squeeze-release latching rail mechanism. The slidable carrier module comprises a push-pull tab and a snap-fit mechanism, and is slidably mounted to the second track and squeeze-release latching rail mechanism. The slidable carrier module is slidably mounted to the chassis vertically. The snap-fit mechanism is configured to secure and release the slidable carrier module in and from a first stage position when corresponding to the first stage access fixing recess, and in and from a second stage position when corresponding to the second stage access fixing recess, via pulling and pushing of the at least a push-pull tab, respectively, providing staged access to the slidable carrier module and staged management of the connector cables extending to and therefrom.

A mobile terminal is provided, which includes: a housing, having a tray installation hole; a circuit board, disposed inside the housing; a tray retention portion, disposed inside the housing, where the tray retention portion faces toward the circuit board; a card holder, disposed on the circuit board; a tray, movably disposed in the tray installation hole and movably mating with the tray retention portion, at least the tray or the housing is provided with an ejection hole; and a toggle piece, rotatably disposed at the tray retention portion and located between the card holder and the ejection hole, one end of the toggle piece is an ejector pin action receiving end, the other end of the toggle piece is a tray ejection end, and the tray ejection end is used to apply an ejection force to the tray after a force is applied to the ejector pin action receiving end.

The present disclosure provides a holding apparatus which includes a base tray and an expansion tray. The base tray can hold a first board, and the expansion tray can hold a second board. The expansion tray can fit within the base tray and can have a transition mechanism. The transition mechanism can engage first connectors on the first board to second connectors on the second board, or disengage the first connectors from the second connectors.

A hard drive enclosure with functionality of quick-release, is for application in a host computer, and comprises: an accommodating unit, a plurality of removable units, a connection inter face module, and a connection module. Wherein the accommodating unit has an accommodating space and a receiving opening. And the plurality of removable units is inserted into the accommodating space through the receiving opening, and each of the plurality of removable units carries with a storage device. In the present invention, according to particular design of electrical connectors constituted by printed circuit board assembly, so as to improve insufficient space for electrical routing. In other words, the hard drive enclosure of the present invention includes advantages of decreasing assembly time and low production cost.

An information handling system includes a peripheral interface and a frame that is operable to receive an Open Compute Project (OCP) module. The frame includes a peripheral slot that provides an electrical communication between the OCP module and the peripheral interface when the OCP module is disposed at a first position. A lock controls the ejection of the OCP module from the first position to a second position, and disengages from the OCP module at the second position.

Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

A modular high density communications chassis, comprising a chassis and slidable carrier module is provided. The chassis comprises a second track having a first and second stage access fixing recess and a sectional sliding mechanism having a moveable squeeze-release latching rail mechanism. The slidable carrier module comprises a push-pull tab and a snap-fit mechanism, and is slidably mounted to the second track and squeeze-release latching rail mechanism. The slidable carrier module is slidably mounted to the chassis vertically. The snap-fit mechanism is configured to secure and release the slidable carrier module in and from a first stage position when corresponding to the first stage access fixing recess, and in and from a second stage position when corresponding to the second stage access fixing recess, via pulling and pushing of the at least a push-pull tab, respectively, providing staged access to the slidable carrier module and staged management of the connector cables extending to and therefrom.

An apparatus for preventing over-discharging according to various embodiments of the present invention may comprise: a housing including a first opening; a first electronic component disposed inside the housing; a second electronic component electrically connected to the first electronic component; and a switch for electrically connecting or disconnecting the first electronic component and the second electronic component through an external force by a pin inserted through the first opening. In addition, various embodiments may be possible.

An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.