An electrical connector, used for electrically connecting a chip module to a circuit board, comprising: an insulating body, provided with a plurality of accommodating openings; and a plurality of terminals, correspondingly accommodated in the accommodating openings respectively, wherein each terminal has a connection portion, two sides of the connection portion bend and extend to form a first clamping arm and a second clamping arm, respectively, the first clamping arm and the second clamping arm together clamp a solder material, the first clamping arm has a first upper edge and a first lower edge arranged opposite to each other, and the length of the first upper edge is not equal to the length of the first lower edge. Under conditions of not increasing the length of a metal billet, the length of the first upper edge is increased, and the length of the first lower edge is decreased.

An electrical connector includes a reinforcing plate, which is encapsulated by an insulating body by injection molding. Positioning structures are provided in terminal slots of the insulating body. The insulating body is made of an elastic insulating material. Multiple terminals are mounted on the positioning structures. Each metal terminal is provided with an upper contact portion and a lower contact portion. When the upper contact portions is in contact with a chip module, and the lower contact portions is in contact with a circuit board, each of the metal terminals interferes with an inner wall of the corresponding terminal slot, so as to solve the metal fatigue of the metal terminals and to ensure the strength of the metal terminals.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

An electronic device (100, 800, 1000) and associated methods are disclosed. In one example, the electronic device (100, 800, 1000) includes an interconnect socket (102, 302, 402, 802, 1004, 1320, 1402, 1506) that includes a liquid metal. In selected examples, the interconnect socket (102, 302, 402) includes a resilient material spacer (130, 230, 330, 430) located between pins (110, 210, 310, 410) in an array of pins (110, 210, 310, 410). In selected examples, the electronic device (1000) includes configurations to aid in de-socketing.

When each signal line contact terminal (10ai) is installed in a base member (30), an upper housing (28), and a lower housing (26), the upper housing (28) is installed together in such a way as to be sandwiched between the base member (30) and the lower housing (26). Here, collars (16) are fitted on outer peripheral portions of a first extending portion (52A) and a second extending portion (52C) of the signal line contact terminal (10ai), respectively. Moreover, air layers are formed between an outer peripheral portion of a drum portion (52B) of the signal line contact terminal (10ai) and an inner peripheral surface forming a hole (28b), between an outer peripheral portion of the first extending portion (52A) and an inner peripheral surface forming a hole (30b), between an outer peripheral portion of the second extending portion (52C) and an inner peripheral surface forming a hole (26b), and between an outer peripheral portion of a plunger (56) and an inner peripheral surface forming a hole (26e).

A pressing member is used for downwardly pressing on a chip module. The pressing member has a main body and a central opening going through the main body. The main body has an upper surface and a lower surface opposite to the upper surface. The central opening is provided for a part portion of the chip module going through. The pressing member has a pressing portion protrudes upwardly from the upper surface and provided for an external device pressing downwardly on to make the main body press downwardly on the chip module so as to prevent the chip module from warping.

An electrical connector is used for electrically connecting a chip module to a circuit board, and includes a body for upward supporting the chip module. The body is provided with multiple accommodating holes. Multiple terminals are respectively accommodated in the accommodating holes correspondingly. Each terminal is provided with at least one soldering portion in contact with a solder and being soldered to the circuit board. A first portion and a second portion are formed by extending upward from the at least one soldering portion and are located at two opposite sides of the solder. An elastic arm bends upward and extends from the second portion for abutting the chip module. When the chip module presses the elastic arm downward, the elastic arm abuts the first portion. Therefore, two conductive paths are formed in parallel to each other.

Techniques and mechanisms for providing connectivity to an integrated circuit device via a hardware interface. In an embodiment, the hardware interface includes contacts forming an array of nodes. Some or all such nodes are arranged in cells, wherein the respective node types of each cell's nodes are according to the same cell pattern. The cell pattern includes eight B nodes for the exchange of data bits, four strobe S nodes for the exchange of strobe signals, and ground (G) nodes for the providing of one or more reference potentials. The cell pattern enables formation of a lattice structure including node-contiguous G nodes each of a respective one of the multiple cells. In another embodiment, a ratio of bi-level nodes (including all S nodes and all G nodes) of the cell pattern to a total number of G nodes of the cell pattern is 12:8 or more.

An electrical connector and the buckle assembly thereof. The buckle assembly includes a stiffener for receiving a socket, a load plate for pressing the chip module, and a guide frame pivoted to the stiffener. A rear end of the load plate is pivoted to the stiffener. The guide frame has an opening for receiving the chip module, and two side arms located on two opposite sides of the opening and a rear arm connected to the two side arms. Each of the side arms is provided with a sliding rail for carrying a side plate of a clamping member. The side plate is slidable along the sliding rail. The clamping member is used for fixing the chip module. A protruding portion is formed by protruding upward from the sliding rail, making the protruding portion higher than the sliding rail.

A ball grid array (BGA) connector including an outer housing, an insert mounted within the outer housing having a first side and a second side, and a plurality of electrical contacts provided within the insert. The BGA connector also includes a plurality of connector balls electrically coupled to the electrical contacts at the first side of the insert, where some of the connector balls have a low Young's modulus and some of the connector balls have a high Young's modulus such that the high Young's modulus connector balls carry more of a separation load than the low Young's modulus connector balls. In one embodiment, the high Young's modulus connector balls are located around an outer periphery of the BGA. Also, the high modulus connector balls are soldered to larger solder pads than the low modulus connector balls.